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参数资料
| 型号： | G150SPBK06P3H |
| 元件分类： | IGBT 晶体管 |
| 英文描述： | 150 A, 600 V, N-CHANNEL IGBT |
| 封装： | HERMETIC SEALED, PLASTIC, INT-A-PAK 3, 7 PIN |
| 文件页数： | 1/5页 |
| 文件大小： | 138K |
| 代理商： | G150SPBK06P3H |
www.irf.com
1
06/03/09
Features:
n Rugged, Light Weight near Hermetic Package
with Integrated Power Terminals
n Gen IV IGBT Technology
n Soft Recovery Rectifier Diodes
n Ultra Low Thermal Resistance
n Zener Gate Protection Diodes
n Very Low Conduction and Switching Losses
n -55°C to +125°C Operation
n Screening to meet the intent of MIL-PRF-38534
n Short Circuit Capability
n 2.0 Ohms Series Gate Resistor
n High Altitude Operation, 85,000 Feet Above
Sea Level at Rated Voltage
HiRelTM INT-A-Pak 3, PLASTIC
G150SPBK06P3H
FULL-BRIDGE IGBT MODULE
The HiRelTM INT-A-Pak series are isolated near
hermetic power modules which combine the latest
IGBT and Soft Recovery Rectifier Technology. They
use both high-speed and low Vce(sat) IGBT for
ultra low thermal resistance.The G150SPBK06P3H
consists of six IGBTs and six FREDs in a full-bridge
configuration and has an SCR inrush current
limiter.
HiRelTM INT-A-Pak 3
Thermal Resistance measurements are at Steady State condition.
Thermal-Mechanical Specifications
Parameter
Symbol
Min
Typ
Max
Units
IGBT Thermal Resistance, Junction to Case, per Switch
c
-0.2
0.24
Inverter Bridge Diode Thermal Resistance, Junction to Case, per Switch
c
-0.38
0.45
Regen Diode Thermal Resistance, Junction to Case, per Switch
c
-0.6
0.80
SCR Thermal Resistance, Junction to Case
c
-0.21
0.27
Operating Junction Temperature Range
TJ
-55
-
150
Storage Temperature Range
TSTG
-55
-
125
Screw Torque - Mounting
Screw Torque - Terminals
Module Weight
--
410
g
RthJC
°C/W
°C
T26
in-lbs
--
Product Summary
Part Number
VCE
IC
G150SPBK06P3H
600V
150A
2.3V Typ.
2.6V Max.
VCE(SAT)
PD-97398
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