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参数资料
| 型号： | G3VM-61G2 |
| 厂商： | Omron Electronics Inc-EMC Div |
| 文件页数： | 4/6页 |
| 文件大小： | 0K |
| 描述： | RELAY SSR FET SPST 60V 4SOP |
| 产品培训模块： | Medical Solutions |
| 产品目录绘图： | G3VM Series Circuit G3VM Series Footprint G3VM Series 4-SOP |
| 标准包装： | 100 |
| 系列： | G3VM |
| 电路： | SPST-NO（1 Form A） |
| 输出类型： | AC，DC |
| 导通状态电阻： | 2 欧姆 |
| 负载电流： | 400mA |
| 输入电压： | 1.15VDC |
| 电压 - 负载： | 0 ~ 60 V |
| 安装类型： | 表面贴装 |
| 端接类型： | 鸥翼型 |
| 封装/外壳： | 4-SOP（0.228"，5.80mm） |
| 供应商设备封装： | 4-SOP |
| 包装： | 管件 |
| 继电器类型： | 继电器 |
| 产品目录页面： | 2636 (CN2011-ZH PDF) |
| 其它名称： | G3VM61G2 Z3019 |
■ Solder Mounting
Perform solder mounting under the following recommended conditions
to prevent the temperature of the relays from rising, causing possible
damage to the relays.
Flow Soldering
Through Hole Packages (Once only)
SSOP Handling Precautions
Humidity-resistant Packaging
Component cases can crack if surface-mounted components that
have absorbed moisture are subjected to thermal stress when
mounting. To prevent this, observe the following precautions.
1. Unopened components can be stored in the packaging at
5 to 30 ° C and a humidity of 90% max. However, they should
Solder type Preheating
Temperature
Lead solder 150 ° C,
(SnPb) 60 to 120s
Lead-free solder 150 ° C,
(SnAgCu) 60 to 120s
Solder
Temperature
260 ° C,
10s max.
260 ° C,
10s max.
be used within 12 months.
2. After the packaging has been opened, components can be
stored at 5 to 30 ° C and a humidity of 70% max. However, they
should be mounted within 168 hours.
3. If, after opening the packaging, the humidity indicator turns
pink to the 30% mark or the expiration date is exceeded, then
bake the components while they are still on the taping reel
Note: It is recommended that the suitability of solder mounting be
verified under actual conditions
Reflow Soldering
Surface Mount Packages (Twice max.)
and use them within 72 hours. Do not bake the same compo-
nents more than once.
Baking conditions: 60 ± 5 ° C, 64 to 72 hours
4. If the same components are baked repeatedly, then the tape
detachment strength will change, causing potential problems
when mounting. Use caution when mounting under these
conditions.
5. When mounting using dehumidifying measures, always take
Solder type
Preheating
Temperature*
Soldering
Temperature*
countermeasures against component damage from static
electricity.
Lead solder 140 to 160 ° C,
(SnPb) 60 to 120s
Lead-free solder 180 to 190 ° C,
(SnAgCu) 60 to 120s
210 ° C,
30s max.
230 ° C,
30 to 50s
Peak,
240 ° C max.
Peak,
260 ° C max.
6. Do not throw or drop the components. If the laminated pack-
aging material is damaged, airtightness will be lost.
7. Tape cut SSOP’s are packaged without humidity resistance.
Use manual soldering to mount them.
*Measured from the top surface of the relay package
Note: 1. It is recommended that the suitability of solder mounting be
verified under actual conditions
2. Tape cut SSOP’s are packaged without humidity resistance.
Use manual soldering to mount them.
Manual Soldering (Once only)
Manually solder at 350 ° C for 3s or less or at 260 ° C for 10s or less.
4
MOS FET Relays
Technical Information
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相关代理商/技术参数 |
参数描述 |
|---|---|
| G3VM-61G2_10 | 制造商:OMRON 制造商全称:Omron Electronics LLC 功能描述:MOS FET Relays |
| G3VM-61G2TR | 制造商:OMRON 制造商全称:Omron Electronics LLC 功能描述:MOS FET Relays |
| G3VM-61G3 | 制造商:Omron Corporation 功能描述:RELAY SSR FET SPST 60V 4SOP |
| G3VM-61G3(TR) | 制造商:Omron Corporation 功能描述:RELAY SSR FET SPST 60V 4SOP |
| G3VM61G3TR | 制造商:Omron Corporation 功能描述:RELAY SSR FET SPST 60V 4SOP |
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