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参数资料
| 型号： | GL390V |
| 厂商： | Sharp Microelectronics |
| 文件页数： | 1/5页 |
| 文件大小： | 0K |
| 描述： | EMITTER IR 950NM 9MW T/H |
| 标准包装： | 1,000 |
| 电流 - DC 正向(If)： | 100mA |
| 辐射强度(le)最小值@正向电流： | 13mW/sr @ 50mA |
| 波长： | 950nm |
| 正向电压： | 1.3V |
| 视角： | 36° |
| 方向： | 侧视图 |
| 安装类型： | 通孔 |
| 封装/外壳： | 径向 |
GL390/GL390V
GL390/GL390V
Thin Bow Type Resin Mold
Package Infrared Emitting Diodes
s Features
1. Thin bow type resin mold package
(Resin area : 2.0 x 3.1 x 5.2 mm)
2. Low peak forward voltage ( GL390V )
s Outline Dimensions
(Unit : mm)
V FM : TYP. 1.9V at I FM =0.5A
s Applications
φ 3.8 ± 0.3
φ 3.1
g 1
Epoxy resin
- 0.3
2.0 + 0.1
1
1. Cameras
2. Infrared remote controllers
2
1 Anode
2 Cathode
2 - 0.5 ± 0.1
1
2
(2.54)
2 - 0.5 ± 0.1
g 1 Resin type
GL390
Pale blue transparent resin
s Model Lineup
* Tolerance : ± 0.2mm
GL390V
Blue transparent resin
Model
Radiant intensity (mW/sr)
GL390
TYP. 13
GL390V
TYP. 16
Half intensity angle (? )
s Absolute Maximum Ratings
TYP. ± 18
(Ta=25?C)
Peak forward current
*1
Parameter
Forward current
Reverse voltage
Power dissipation
Operating temperature
Storage temperature
Symbol
I F
I FM
V R
P
T opr
T stg
Rating
60
1
6
150
- 25 to 85
- 40 to 85
Unit
mA
A
V
mW
?C
?C
*2
Soldering temperature
T sol
260
?C
*1 Pulse width <=100 μ s, Duty ratio=0.01
*2 For 3 seconds at the position of 2.6 mm from the resin edge
“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device. ”
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