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| 型号： | GRM31MF51C155ZA01L |
| 厂商： | Murata Electronics North America |
| 文件页数： | 171/182页 |
| 文件大小： | 0K |
| 描述： | CAP CER 1.5UF 16V Y5V 1206 |
| 产品培训模块： | High-Cap Multilayer Ceramic Capacitors |
| 产品目录绘图： | GRM Series_1206_1.15 |
| 特色产品： | GA3 Safety Recognized Caps and Hi-Cap MLCC |
| 标准包装： | 1 |
| 系列： | GRM |
| 电容： | 1.5µF |
| 电压 - 额定： | 16V |
| 容差： | -20%，+80% |
| 温度系数： | Y5V（F） |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -30°C ~ 85°C |
| 应用： | 通用 |
| 封装/外壳： | 1206（3216 公制） |
| 尺寸/尺寸： | 0.126" L x 0.063" W（3.20mm x 1.60mm） |
| 厚度（最大）： | 0.049"（1.25mm） |
| 包装： | 标准包装 |
| 产品目录页面： | 2162 (CN2011-ZH PDF) |
| 其它名称： | 490-1836-6 |
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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
! Caution
Continued from the preceding page.
<Applicable to GMA or GMD Series>
9. Die Bonding/Wire Bonding
C02E.pdf
Sep.25,2013
1. Die Bonding of Capacitors
1-1. Use the following materials for the Brazing alloys:
Au-Sn (80/20) 300 to 320 °C in N 2 atmosphere
1-2. Mounting
(1) Control the temperature of the substrate so it
matches the temperature of the brazing alloy.
(2) Place the brazing alloy on the substrate and place
the capacitor on the alloy. Hold the capacitor and
gently apply the load. Be sure to complete the
operation within 1 minute.
c Other
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands
during operation in order to avoid the danger of an
electric shock.
1-2. Do not allow the terminals of a capacitor to come in
contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid,
including any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will
operate is under the specified conditions.
Do not use the equipment under the following
environments.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to ozone, ultraviolet rays, or
radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide,
sulfur dioxide, chlorine, ammonia gas, etc.)
(5) Any vibrations or mechanical shocks exceeding the
specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any
conditions that can cause condensation.
2. Other
2-1. In an Emergency
(1) If the equipment should generate smoke, fire, or
smell, immediately turn off or unplug the equipment.
If the equipment is not turned off or unplugged, the
hazards may be worsened by supplying continuous
power.
(2) In this type of situation, do not allow face and
hands to come in contact with the capacitor or
burns may be caused by the capacitor's high
temperature.
152
2. Wire Bonding
2-1. Wire
Gold wire: 25 micro m (0.001 inch) diameter
2-2. Bonding
(1) Thermo compression, ultrasonic ball bonding.
(2) Required stage temperature: 150 to 200 °C
(3) Required wedge or capillary weight: 0.2N to 0.5N
(4) Bond the capacitor and base substrate or other
devices with gold wire.
2-2. Disposal of Waste
When capacitors are disposed of, they must be
burned or buried by an industrial waste vendor with
the appropriate licenses.
2-3. Circuit Design
(1) Addition of Fail Safe Function
Capacitors that are cracked by dropping or
bending of the board may cause deterioration of
the insulation resistance, and result in a short.
If the circuit being used may cause an electrical
shock, smoke or fire when a capacitor is shorted,
be sure to install fail-safe functions, such as a
fuse, to prevent secondary accidents.
(2) Capacitors used to prevent electromagnetic
interference in the primary AC side circuit, or as a
connection/insulation, must be a safety standard
certified product, or satisfy the contents stipulated
in the Electrical Appliance and Material Safety
Law. Install a fuse for each line in case of a short.
(3) The GJM, GMA, GMD, GQM, GR3, GRJ, GRM,
KR3, KRM, LLA, LLL, LLM and LLR series are
not safety standard certified products.
2-4. Remarks
Failure to follow the cautions may result, worst case,
in a short circuit and smoking when the product is
used.
The above notices are for standard applications and
conditions. Contact us when the products are used in
special mounting conditions.
Select optimum conditions for operation as they
determine the reliability of the product after assembly.
The data herein are given in typical values, not
guaranteed ratings.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| GRM31MF51C155ZC01B | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 1206 1.5uF 16volt Y5V +80/-20% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| GRM31MF51C155ZC01K | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 1206 1.5uF 16volts Y5V +80-20% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| GRM31MF51C155ZC01L | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 1206 1.5uF 16volts Y5V +80-20% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| GRM31MF51C155ZC17L | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 1206 1.5uF 16volts Y5V +80-20% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| GRM31MF51C225ZA01 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:High Dielectric Constant Type 6.3/16/25/50V |
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