参数资料
型号: HCPL-268K-100
英文描述: Hermetically Sealed. High Speed. High CMR. Logic Gate Optocouplers
中文描述: 密封。高速。高CMR。逻辑门光电耦合器
文件页数: 5/12页
文件大小: 259K
代理商: HCPL-268K-100
2
Selection Guide–Package Styles and Lead Configuration Options
Package
16 Pin DIP
8 Pin DIP
16 Pin Flat Pack 20 Pad LCCC
Lead Style
Through Hole Through Hole Through Hole Through Hole
Unformed Leads
Surface Mount
Channels
2122
4
2
Common Channel
VCC, GND
None
VCC, GND
None
Wiring
Withstand Test Voltage
1500 Vdc
2500 Vdc
1500 Vdc
Agilent Part # & Options
Commercial
6N134*
HCPL-5600
HCPL-5630
HCPL-5650
HCPL-6650
HCPL-6630
MIL-PRF-38534, Class H
6N134/883B
HCPL-5601
HCPL-5631
HCPL-5651
HCPL-6651
HCPL-6631
MIL-PRF-38534, Class K
HCPL-268K
HCPL-560K
HCPL-563K
HCPL-665K
HCPL-663K
Standard Lead Finish
Gold Plate
Solder Pads
Solder Dipped
Option #200
Butt Cut/Gold Plate
Option #100
Gull Wing/Soldered
Option #300
Class H SMD Part #
Prescript for all below
None
5962-
None
Either Gold or Solder
8102801EX
9085501HPX
8102802PX
8102805PX
8102804FX
81028032X
Gold Plate
8102801EC
9085501HPC
8102802PC
8102805PC
8102804FC
Solder Dipped
8102801EA
9085501HPA
8102802PA
8102805PA
81028032A
Butt Cut/Gold Plate
8102801UC
9085501HYC
8102802YC
Butt Cut/Soldered
8102801UA
9085501HYA
8102802YA
Gull Wing/Soldered
8102801TA
9085501HXA
8102802ZA
Class K SMD Part #
Prescript for all below
5962-
Either Gold or Solder
9800101KEX 9085501KPX
9800102KPX
9800104KFX
9800103K2X
Gold Plate
9800101KEC 9085501KPC
9800102KPC
9800104KFC
Solder Dipped
9800101KEA 9085501KPA
9800102KPA
9800103K2A
Butt Cut/Gold Plate
9800101KUC 9085501KYC
9800102KYC
Butt Cut/Soldered
9800101KUA 9085501KYA
9800102KYA
Gull Wing/Soldered
9800101KTA
9085501KXA
9800102KZA
*JEDEC registered part.
Each channel contains a GaAsP
light emitting diode which is
optically coupled to an integrated
high speed photon detector. The
output of the detector is an open
collector Schottky clamped
transistor. Internal shields
provide a guaranteed common
mode transient immunity
specification of 1000 V/
s. For
Isolation Voltage applications
requiring up to 2500 Vdc, the
HCPL-5650 family is also
available. Package styles for
these parts are 8 and 16 pin DIP
through hole (case outlines P and
E respectively), and 16 pin
surface mount DIP flat pack
(case outline F), leadless ceramic
chip carrier (case outline 2).
Devices may be purchased with a
variety of lead bend and plating
options. See Selection Guide
Table for details. Standard
Microcircuit Drawing (SMD)
parts are available for each
package and lead style.
Because the same electrical die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the figures
are identical for all parts.
Occasional exceptions exist due to
package variations and limitations,
and are as noted. Additionally, the
same package assembly processes
and materials are used in all
devices. These similarities give
justification for the use of data
obtained from one part to
represent other parts’ performance
for reliability and certain limited
radiation test results.
相关PDF资料
PDF描述
HCPL-268K-300 Hermetically Sealed. High Speed. High CMR. Logic Gate Optocouplers
HCPL-563K-100 Receptacle With No Tail
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HCPL-6630 Hermetically Sealed. High Speed. High CMR. Logic Gate Optocouplers
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