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参数资料
型号： HDAF-15-08.0-S-13-2-P
厂商： SAMTEC INC
元件分类： 电路板相叠连接器
英文描述： 195 CONTACT(S), FEMALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT, SOCKET
封装： ROHS COMPLIANT
文件页数： 1/1页
文件大小： 798K
代理商： HDAF-15-08.0-S-13-2-P
(2,00mm) .0787"
HDAM, HDAF SERIES
HDAM–11–12.0–S–13–2
HDAF–23–08.0–S–13–2
WWW.SAMTEC.COM
HDAM Mates with:
HDAF
HDAF Mates with:
HDAM
For complete specications and
recommended PCB layouts see
www.samtec.com?HDAM or
www.samtec.com?HDAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Current Rating:
2.3A @ 80°C ambient
Operating Temp Range:
-55°C to +125°C
Plating:
Au or Sn over
50" (1,27m) Ni
Contact Resistance:
19 m
Ω max
Working Voltage:
200 VAC
Mated Cycles:
100
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
F-210-1
SPECIFICATIONS
finalinch.com
MEZZ
DIFFERENTIAL
APPLICATIONS
PAIR
COUNT*
ARRAY
44
60
92
11x13
15x13
23x13
(1,20)
.0472
(2,00)
.0787
*2:1 S:G Ratio
Note: HD Mezz is a trademark
of Molex Incorporated
Note: Some lengths, styles
and options are non-standard,
non-returnable.
ALSO AVAILABLE
Tin-Lead Solder Charge.
Call Samtec.
Note: Other Gold plating
options available.
Contact Samtec.
HDAM
NO. OF PINS
PER ROW
PLATING
OPTION
OTHER
OPTION
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
–P
= Pick &
Place Pad
–S
= 30"
(0,76m)
Gold on
contact area,
Matte Tin
on tails and
guide pins
SOLDER
TYPE
NO. OF
ROWS
–13
–2
= Lead-Free
Tin Alloy
95.5% Sn/
3.8% Ag/0.7% Cu
Solder Charge
–11, –15, –23
HDAF
NO. OF PINS
PER ROW
PLATING
OPTION
OTHER
OPTION
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
–P
= Pick &
Place Pad
–S
= 30"
(0,76m)
Gold on
contact area,
Matte Tin
on tails and
weld tabs
SOLDER
TYPE
NO. OF
ROWS
–13
–2
= Lead-Free
Tin Alloy
95.5% Sn/
3.8% Ag/
0.7% Cu
Solder Charge
–11, –15, –23
LEAD
STYLE
–12.0
–17.0
A
(14,41)
.567
(19,41)
.764
(2,00)
.0787
(22,50)
.886
No. of
Pins
Per
Row
x
(2,00)
.0787
+
(11,55)
.455
No. of
Pins
Per
Row
x
(2,00)
.0787
+
(16,06)
.632
A
1A
1M
(1,20)
.0472
(5,09)
.200
LEAD
STYLE
–08.0
–18.0
A
(10,51)
.414
(20,51)
.807
No.
of
Pins
Per
Row
x
(2,00)
.0787
+
(17,92)
.706
A
No.
of
Pins
Per
Row
x
(2,00)
.0787
+
(11,55)
.455
(22,50) .886
(1,20)
.0472
(2,00)
.0787
1A
1M
35mm Stack Height
Rated @ -3dB
Insertion Loss*
Single-Ended Signaling
9.0 GHz / 18.0 Gbps
Differential Pair Signaling
9.0 GHz / 18.0 Gbps
*Data based on simulations using Final Inch design.
Performance data for other stack heights and complete
test data available at www.samtec.com?HDAM,
www.samtec.com?HDAF or contact sig@samtec.com
RUGGED ELEVATED HIGH DENSITY ARRAY
Integrated guide
posts
Integrated guide
posts
相关PDF资料
PDF描述
HDAF-15-18.0-S-13-2-P 195 CONTACT(S), FEMALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT, SOCKET
HDAF-23-08.0-S-13-2-P 299 CONTACT(S), FEMALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT, SOCKET
HDAF-23-18.0-S-13-2-P 299 CONTACT(S), FEMALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT, SOCKET
HM1F41TAP400H6LF 24 CONTACT(S), FEMALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER, RECEPTACLE
HM1F41TAP400H6PLF 24 CONTACT(S), FEMALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER, RECEPTACLE
相关代理商/技术参数
参数描述
HDAF-15-18.0-S-13-1 功能描述:CONN HD ARRAY 195POS FEMALE GOLD RoHS:否 类别:连接器，互连式 >> 板对板 - 阵列，边缘类型，包厢 系列:HD Mezz™ HDAF 标准包装:16 系列:FX6 连接器类型:接头，外罩触点 位置数:60 间距:0.031"（0.80mm） 行数:2 安装类型:表面贴装 特点:板导轨 触点表面涂层:金 触点涂层厚度:- 包装:管件 配接层叠高度:6mm，8mm 板上方高度:0.236"（6.00mm） 其它名称:*FX6-60P-0.8SV1H2417
HDAF-15-18.0-S-13-1 制造商:Samtec Inc 功能描述:CONNECTOR HD FEMALE 195WAY
HDAF-15-18.0-S-13-1-P 制造商:Samtec Inc 功能描述:2.0MM PITCH HD ARRAY SOCKET ASSEMBLY - Bulk
HDAF-15-18.0-S-13-2 功能描述:CONN HD ARRAY 195POS FEMALE GOLD RoHS:是 类别:连接器，互连式 >> 板对板 - 阵列，边缘类型，包厢 系列:HD Mezz™ HDAF 标准包装:16 系列:FX6 连接器类型:接头，外罩触点 位置数:60 间距:0.031"（0.80mm） 行数:2 安装类型:表面贴装 特点:板导轨 触点表面涂层:金 触点涂层厚度:- 包装:管件 配接层叠高度:6mm，8mm 板上方高度:0.236"（6.00mm） 其它名称:*FX6-60P-0.8SV1H2417
HDAF-15-18.0-S-13-2-P 制造商:Samtec Inc 功能描述:CONN ELEVATED ARY TERM SKT 195 POS 2MM SLDR ST SMD - Bulk
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