参数资料
| 型号： | HFA1130IBZ-T |
| 厂商： | Intersil |
| 文件页数： | 5/13页 |
| 文件大小： | 0K |
| 描述： | IC BUFFER CFA 850MHZ 8-SOIC |
| 标准包装： | 2,500 |
| 放大器类型： | 电流反馈 |
| 电路数： | 1 |
| 转换速率： | 2300 V/µs |
| -3db带宽： | 850MHz |
| 电流 - 输入偏压： | 25µA |
| 电压 - 输入偏移： | 2000µV |
| 电流 - 电源： | 21mA |
| 电流 - 输出 / 通道： | 60mA |
| 电压 - 电源，单路/双路(±)： | ±4.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 带卷 (TR) |
13
FN3369.5
April 25, 2013
HFA1130
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
TOP VIEW
INDEX
AREA
12
3
-C-
SEATING PLANE
x 45°
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
SIDE VIEW “A
SIDE VIEW “B”
1.27 (0.050)
6.20 (0.244)
5.80 (0.228)
4.00 (0.157)
3.80 (0.150)
0.50 (0.20)
0.25 (0.01)
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
0.25(0.010)
0.10(0.004)
0.51(0.020)
0.33(0.013)
8°
0°
0.25 (0.010)
0.19 (0.008)
1.27 (0.050)
0.40 (0.016)
1.27 (0.050)
5.20(0.205)
1
2
3
4
5
6
7
8
TYPICAL RECOMMENDED LAND PATTERN
2.20 (0.087)
0.60 (0.023)
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| EL5364IUZ-T7 | IC AMP 600MHZ CURR FB 16-QSOP |
| 951244-4620-AR-TP | CONN HEADER 44POS 2MM R/A SMD |
| HFA1112IBZ96 | IC BUFFER 850MHZ 8-SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HFA1130IJ | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HFA1130IP | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HFA-1130IP | 制造商:Harris Corporation 功能描述: |
| HFA1130MJ/883 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HFA1130ML/883 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Output Clamping, 850MHz Current Feedback Amplifier |
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