参数资料
型号: HI-201HS
厂商: Intersil Corporation
英文描述: Flash 8Mb PROM (ST Micro),
中文描述: 高速、四路SPST、CMOS模拟开关
文件页数: 11/11页
文件大小: 253K
代理商: HI-201HS
11
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
Die Characteristics
DIE DIMENSIONS:
2440
μ
m x 2860
μ
m x 485
μ
m
METALLIZATION:
Type: CuAl
Thickness: 16k
±
2k
PASSIVATION:
Type: Nitride Over Silox
Nitride Thickness: 3.5k
±
1k
Silox Thickness: 12k
±
2k
WORST CASE CURRENT DENSITY:
9.5 x 10
4
A/cm
2
Metallization Mask Layout
HI-201HS
A1
A2
OUT2
IN2
V+
IN3
OUT3
A3
A4
OUT4
IN4
GND
V-
IN1
OUT1
HI-201HS
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