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参数资料
| 型号： | HI1-0549-2 |
| 厂商： | Intersil |
| 文件页数： | 7/24页 |
| 文件大小： | 0K |
| 描述： | IC MULTIPLEXER DUAL 4X1 16CDIP |
| 标准包装： | 25 |
| 功能： | 多路复用器 |
| 电路： | 2 x 4:1 |
| 导通状态电阻： | 1.5 千欧 |
| 电压电源： | 双电源 |
| 电压 - 电源，单路/双路(±)： | ±15V |
| 电流 - 电源： | 500µA |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 16-CDIP（0.300"，7.62mm） |
| 供应商设备封装： | 16-CDIP |
| 包装： | 管件 |
15
Die Characteristics
DIE DIMENSIONS:
83.9 mils x 159 mils
METALLIZATION:
Type: CuAl
Thickness: 16k
±2k
SUBSTRATE POTENTIAL (NOTE):
-VSUPPLY
PASSIVATION:
Type: Nitride Over Silox
Nitride Thickness: 3.5k
±1k
Silox Thickness: 12k
±2k
WORST CASE CURRENT DENSITY:
1.4 x 105 A/cm2
TRANSISTOR COUNT:
485
PROCESS:
CMOS-DI
NOTE: The substrate appears resistive to the -VSUPPLY terminal, therefore it may be left floating (Insulating Die Mount) or it may be mounted on a
conductor at -VSUPPLY potential.
Metallization Mask Layouts
HI-546
HI-547
IN 9
IN 10
IN 11
IN 12
IN 13
IN 14
IN 15
IN 16
V- (27)
+V (1)
NC (2)
IN 1
IN 2
IN 3
IN 4
IN 5
IN 6
IN 7
IN 8
EN
A0
A1 A2
VREF
GND
(18)
(17)
(16) (15)
(13)
(12)
(19)
(20)
(21)
(22)
(23)
(24)
(25)
(26)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
OUT (28)
A3
(14)
IN 1B
IN 2B
IN 3B
IN 4B
IN 5B
IN 6B
IN 7B
IN 8B
V- (27)
+V (1)
OUT B(2)
IN 1A
IN 2A
IN 3A
IN 4A
IN 5A
IN 6A
IN 7A
IN 8A
EN
A0
A1 A2
NC VREF
GND
(18)
(17)
(16) (15)
(14) (13)
(12)
(19)
(20)
(21)
(22)
(23)
(24)
(25)
(26)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
OUT A (28)
HI-546, HI-547, HI-548, HI-549
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HI1-0549-4 | 制造商:Harris Corporation 功能描述: |
| HI1-0549-5 | 制造商:Harris Corporation 功能描述: |
| HI1-0562AB0850-481 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HI1-0837-5 DIE | 制造商:Harris Corporation 功能描述: |
| HI1106 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:8-Bit, 35 MSPS, High Speed D/A Converter (TTL Input) |
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