参数资料
型号: HI3-0509A-5Z
厂商: Intersil
文件页数: 11/20页
文件大小: 0K
描述: IC MULTIPLEXER DUAL 4X1 16DIP
标准包装: 25
功能: 多路复用器
电路: 2 x 4:1
导通状态电阻: 1.8 千欧
电压电源: 双电源
电压 - 电源,单路/双路(±): ±15V
电流 - 电源: 500µA
工作温度: 0°C ~ 75°C
安装类型: 通孔
封装/外壳: 16-DIP(0.300",7.62mm)
供应商设备封装: 16-PDIP
包装: 管件
19
FN3143.6
October 30, 2007
HI-506A, HI-507A, HI-508A, HI-509A
Ceramic Dual-In-Line Frit Seal Packages (CERDIP)
NOTES:
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
5. This dimension allows for off-center lid, meniscus, and glass
overrun.
6. Dimension Q shall be measured from the seating plane to the
base plane.
7. Measure dimension S1 at all four corners.
8. N is the maximum number of terminal positions.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH.
bbb
C A - B
S
c
Q
L
A
SEATING
BASE
D
PLANE
-D-
-A-
-C-
-B-
α
D
E
S1
b2
b
A
e
M
c1
b1
(c)
(b)
SECTION A-A
BASE
LEAD FINISH
METAL
eA/2
A
M
S
ccc
C A - B
M
D
S
aaa
CA - B
M
D
S
eA
F16.3 MIL-STD-1835 GDIP1-T16 (D-2, CONFIGURATION A)
16 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A-
0.200
-
5.08
-
b
0.014
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D-
0.840
-
21.34
5
E
0.220
0.310
5.59
7.87
5
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
-
eA/2
0.150 BSC
3.81 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.060
0.38
1.52
6
S1
0.005
-
0.13
-7
α
90o
105o
90o
105o
-
aaa
-
0.015
-
0.38
-
bbb
-
0.030
-
0.76
-
ccc
-
0.010
-
0.25
-
M-
0.0015
-
0.038
2, 3
N16
16
8
Rev. 0 4/94
相关PDF资料
PDF描述
PIC18F4410-E/ML IC MCU FLASH 8KX16 44QFN
GRM2197U2A4R5CD01D CAP CER 4.5PF 100V U2J 0805
VI-B2V-IY CONVERTER MOD DC/DC 5.8V 50W
GRM2197U2A4R1CD01D CAP CER 4.1PF 100V U2J 0805
VI-B2T-IY CONVERTER MOD DC/DC 6.5V 50W
相关代理商/技术参数
参数描述
HI3-0509B3053-052 制造商:Harris Corporation 功能描述:
HI3050JCQ 制造商:Rochester Electronics LLC 功能描述:64 PQFP COMTEMP TRIPLE VIDEO D/A 10 BIT 50 MHZ - Bulk 制造商:Harris Corporation 功能描述:
HI3-0516-5 功能描述:IC MULTIPLEXER 16X1 28DIP RoHS:否 类别:集成电路 (IC) >> 接口 - 模拟开关,多路复用器,多路分解器 系列:- 标准包装:48 系列:- 功能:开关 电路:4 x SPST - NO 导通状态电阻:100 欧姆 电压电源:单/双电源 电压 - 电源,单路/双路(±):2 V ~ 12 V,±2 V ~ 6 V 电流 - 电源:50nA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC(0.154",3.90mm 宽) 供应商设备封装:16-SOIC 包装:管件
HI3-0516-5Z 功能描述:多路器开关 IC MUX 16:1/DIFF 8:1 COM RoHS:否 制造商:Texas Instruments 通道数量:1 开关数量:4 开启电阻(最大值):7 Ohms 开启时间(最大值): 关闭时间(最大值): 传播延迟时间:0.25 ns 工作电源电压:2.3 V to 3.6 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UQFN-16
HI3-0518-5 功能描述:IC MULTIPLEXER 8X1 18DIP RoHS:否 类别:集成电路 (IC) >> 接口 - 模拟开关,多路复用器,多路分解器 系列:- 标准包装:48 系列:- 功能:开关 电路:4 x SPST - NO 导通状态电阻:100 欧姆 电压电源:单/双电源 电压 - 电源,单路/双路(±):2 V ~ 12 V,±2 V ~ 6 V 电流 - 电源:50nA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC(0.154",3.90mm 宽) 供应商设备封装:16-SOIC 包装:管件