参数资料
| 型号： | HI5731BIPZ |
| 厂商： | Intersil |
| 文件页数： | 8/17页 |
| 文件大小： | 0K |
| 描述： | IC DAC 12BIT 100MSPS HS 28DIP |
| 标准包装： | 78 |
| 设置时间： | 20ns |
| 位数： | 12 |
| 数据接口： | 并联 |
| 转换器数目： | 1 |
| 电压电源： | 模拟和数字，双 ± |
| 功率耗散（最大）： | 650mW |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 28-DIP（0.600"，15.24mm） |
| 供应商设备封装： | 28-PDIP |
| 包装： | 管件 |
| 输出数目和类型： | 2 电流，单极 |
| 采样率（每秒）： | 100M |
16
HI5731
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and
are measured with the leads constrained to be perpendic-
ular to datum
.
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA
-C-
C
L
E
eA
C
eB
eC
-B-
E1
INDEX
12 3
N/2
N
AREA
SEATING
BASE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
-A-
0.010 (0.25)
C
A
M
BS
E28.6 (JEDEC MS-011-AB ISSUE B)
28 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.250
-
6.35
4
A1
0.015
-
0.39
-
4
A2
0.125
0.195
3.18
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.030
0.070
0.77
1.77
8
C
0.008
0.015
0.204
0.381
-
D
1.380
1.565
35.1
39.7
5
D1
0.005
-
0.13
-
5
E
0.600
0.625
15.24
15.87
6
E1
0.485
0.580
12.32
14.73
5
e
0.100 BSC
2.54 BSC
-
eA
0.600 BSC
15.24 BSC
6
eB
-
0.700
-
17.78
7
L
0.115
0.200
2.93
5.08
4
N28
28
9
Rev. 1 12/00
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PDF描述 |
|---|---|
| HI5741BIBZ-T | CONV D/A 14BIT 100MSPS 28SOIC |
| VE-B7T-MX-S | CONVERTER MOD DC/DC 6.5V 75W |
| LT6551CMS | IC AMP VIDEO QUAD 3.3V 10-MSOP |
| VE-B3B-MU-F3 | CONVERTER MOD DC/DC 95V 200W |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HI5731D DIE | 制造商:Harris Corporation 功能描述: |
| HI5731-EVP | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Harris Corporation 功能描述: |
| HI5731-EVS | 功能描述:数据转换 IC 开发工具 HI5731 EVAL PL ATFORM FOR RoHS:否 制造商:Texas Instruments 产品:Demonstration Kits 类型:ADC 工具用于评估:ADS130E08 接口类型:SPI 工作电源电压:- 6 V to + 6 V |
| HI5735 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:12-Bit, 80 MSPS, High Speed Video D/A Converter |
| HI5735_04 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:12-Bit, 80 MSPS, High Speed Video D/A Converter |
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