1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-352-6832
Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2000, 2005. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
FN4654.6
HI5860
12-Bit, 130MSPS, High Speed D/A
Converter
The HI5860 is a 12-bit, 130MSPS (Mega Samples Per
Second), high speed, low power, D/A converter which is
implemented in an advanced CMOS process. Operating
from a single +3V to +5V supply, the converter provides
20mA of full scale output current and includes
edge-triggered CMOS input data latches. Low glitch energy
and excellent frequency domain performance are achieved
using a segmented current source architecture.
This device complements the HI5x60 and HI5x28 family of high
speed converters, which includes 8, 10, 12, and 14-bit devices.
Pinout
HI5860
(SOIC, TSSOP)
TOP VIEW
Features
Throughput Rate . . . . . . . . . . . . . . . . . . . . . . . .130MSPS
Low Power . . . 175mW at 5V, 32mW at 3V (At 100MSPS)
Integral Linearity Error (Typ) . . . . . . . . . . . . . . .
±
0.5 LSB
Adjustable Full Scale Output Current. . . . . 2mA to 20mA
Internal 1.2V Bandgap Voltage Reference
Single Power Supply from +5V to +3V
Power Down Mode
CMOS Compatible Inputs
Excellent Spurious Free Dynamic Range
(76dBc, f
S
= 50MSPS, f
OUT
= 2.51MHz)
Excellent Multitone Intermodulation Distortion
Pb-Free Available (RoHS Compliant)
Applications
Basestations (Cellular, WLL)
Medical/Test Instrumentation
Wireless Communications Systems
Direct Digital Frequency Synthesis
Signal Reconstruction
High Resolution Imaging Systems
Arbitrary Waveform Generators
Ordering Information
PART
NUMBER
TEMP.
RANGE
(°C)
PACKAGE
PKG.
DWG. #
CLOCK
SPEED
HI5860IA*
-40 to 85 28 Ld TSSOP M28.173
130MHz
HI5860IB
-40 to 85 28 Ld SOIC
M28.3
130MHz
HI5860IBZ
(See Note)
-40 to 85 28 Ld SOIC
(PB-free)
M28.3
130MHz
HI5860SOICEVAL1
25
Evaluation Platform
130MHz
*Add “-T” for tape and reel.
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which are RoHS compliant and compatible
with both SnPb and Pb-free soldering operations. Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
28
27
26
25
24
23
22
21
20
19
18
17
16
15
D11 (MSB)
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0 (LSB)
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
CLK
DCOM
ACOM
AV
DD
COMP2
IOUTB
COMP1
FSADJ
REFIO
REFLO
SLEEP
DV
DD
IOUTA
ACOM
Data Sheet
May 4, 2005