参数资料
型号: HIP2100IR4ZT
厂商: Intersil
文件页数: 11/12页
文件大小: 0K
描述: IC DRIVER HALF BRIDGE 100V 12DFN
标准包装: 6,000
配置: 半桥
输入类型: PWM
延迟时间: 20ns
电流 - 峰: 2A
配置数: 1
输出数: 2
高端电压 - 最大(自引导启动): 114V
电源电压: 9 V ~ 14 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 12-VFDFN 裸露焊盘
供应商设备封装: 12-DFN-EP(4x4)
包装: 带卷 (TR)
HIP2100
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
E
-B-
H
0.25(0.010) M
B M
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
A 0.0532 0.0688 1.35 1.75 -
1
2
3
L
A1
B
0.0040
0.013
0.0098
0.020
0.10
0.33
0.25
0.51
-
9
SEATING PLANE
C
0.0075
0.0098
0.19
0.25
-
-A-
D
A
h x 45°
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e
B
0.25(0.010) M
NOTES:
-C-
C A M
B S
A1
α
0.10(0.004)
C
e
H
h
L
N
α
0.050 BSC
0.2284 0.2440
0.0099 0.0196
0.016 0.050
8
1.27 BSC
5.80 6.20
0.25 0.50
0.40 1.27
8
-
-
5
6
7
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
11
Rev. 1 6/05
FN4022.14
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