参数资料
型号: HIP6006EVAL1
厂商: Intersil
文件页数: 11/12页
文件大小: 0K
描述: EVALUATION BOARD HIP6006
应用说明: HIP6006/07 PWM Controller ICs AppNote
标准包装: 1
主要目的: DC/DC,步降
输出及类型: 1,非隔离
输出电压: 2.5V
电流 - 输出: 9A
输入电压: 10.8 ~ 13.2 V
稳压器拓扑结构: 降压
频率 - 开关: 200kHz
板类型: 完全填充
已供物品:
已用 IC / 零件: HIP6006
HIP6006
Thin Shrink Small Outline Plastic Packages (TSSOP)
N
INDEX
AREA
E1
-B-
E
0.25(0.010) M
GAUGE
PLANE
B M
M14.173
14 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
INCHES MILLIMETERS
SYMBOL MIN MAX MIN MAX
NOTES
1
2
-A-
3
0.05(0.002)
D
SEATING PLANE
A
0.25
0.010
L
A
A1
A2
b
c
-
0.002
0.031
0.0075
0.0035
0.047
0.006
0.051
0.0118
0.0079
-
0.05
0.80
0.19
0.09
1.20
0.15
1.05
0.30
0.20
-
-
-
9
-
e
b
0.10(0.004) M
-C-
C A M
B S
A1
α
0.10(0.004)
A2
c
D
E1
e
E
L
0.195 0.199
0.169 0.177
0.026 BSC
0.246 0.256
0.0177
0.0295
4.95 5.05
4.30 4.50
0.65 BSC
6.25 6.50
0.45
0.75
3
4
-
-
6
N
14
14
7
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AC, Issue E.
α
0 o
8 o
0 o
8 o
-
Rev. 1 6/00
2. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
11
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