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参数资料
| 型号： | HIP6013CB |
| 厂商： | INTERSIL CORP |
| 元件分类： | 稳压器 |
| 英文描述： | FPGA - 100000 SYSTEM GATE 2.5 VOLT - NOT RECOMMENDED for NEW DESIGN |
| 中文描述： | SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PDSO14 |
| 封装： | SOIC-14 |
| 文件页数： | 6/11页 |
| 文件大小： | 103K |
| 代理商： | HIP6013CB |
2-167
The over-current function will trip at a peak inductor current
(I
PEAK
) determined by:
I
DS ON
)
where I
OCSET
is the internal OCSET current source (200
μ
A
- typical). The OC trip point varies mainly due to the
MOSFET’s r
DS(ON)
variations. To avoid over-current tripping
in the normal operating load range, find the R
OCSET
resistor
from the equation above with:
1. Themaximumr
DS(ON)
atthehighestjunctiontemperature.
2. The minimum I
OCSET
from the specification table.
3. Determine
where
I is the output inductor ripple current.
For an equation for the ripple current see the section under
component guidelines titled ‘Output Inductor Selection’.
,
A small ceramic capacitor should be placed in parallel with
R
OCSET
to smooth the voltage across R
OCSET
in the
presence of switching noise on the input voltage.
Application Guidelines
Layout Considerations
As in any high frequency switching converter, layout is very
important. Switching current from one power device to another
can generate voltage transients across the impedances of the
interconnecting bond wires and circuit traces. These
interconnecting impedances should be minimized by using
wide, short printed circuit traces. The critical components
should be located as close together as possible using ground
plane construction or single point grounding.
Figure 5 shows the critical power components of the
converter. To minimize the voltage overshoot the
interconnecting wires indicated by heavy lines should be
part of ground or power plane in a printed circuit board. The
components shown in Figure 6 should be located as close
together as possible. Please note that the capacitors C
IN
and C
O
each represent numerous physical capacitors.
Locate the HIP6013 within 3 inches of the MOSFETs, Q1.
The circuit traces for the MOSFETs’ gate and source
connections from the HIP6013 must be sized to handle up to
1A peak current.
Figure 6 shows the circuit traces that require additional
layout consideration. Use single point and ground plane
construction for the circuits shown. Minimize any leakage
current paths on the SS PIN and locate the capacitor, C
ss
close to the SS pin because the internal current source is
only 10
μ
A. Provide local V
CC
decoupling between VCC and
GND pins. Locate the capacitor, C
BOOT
as close as practical
to the BOOT and PHASE pins.
O
S
0A
0V
TIME (20ms/DIV)
5A
10A
15A
2V
4V
FIGURE 4. OVER-CURRENT OPERATION
I
PEAK
R
---------------------------------------------------
=
I
PEAK
for I
PEAK
I
OUT MAX
)
I
(
)
2
+
>
FIGURE 5. PRINTED CIRCUIT BOARD
POWER AND GROUND PLANES OR ISLANDS
L
O
C
O
UGATE
PHASE
Q1
D2
V
IN
V
OUT
RETURN
HIP6013
C
IN
L
+12V
HIP6013
SS
GND
V
CC
BOOT
D1
L
O
C
O
V
OUT
L
Q1
D2
PHASE
FIGURE 6. PRINTED CIRCUIT BOARD
SMALL SIGNAL LAYOUT GUIDELINES
+V
IN
C
BOOT
C
VCC
C
SS
HIP6013
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HIP6013CB-T | 功能描述:IC CONTROLLER PWM BUCK 14-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,000 系列:- 应用:电源，ICERA E400，E450 输入电压:4.1 V ~ 5.5 V 输出数:10 输出电压:可编程 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:42-WFBGA，WLCSP 供应商设备封装:42-WLP 包装:带卷 (TR) |
| HIP6013CBZ | 功能描述:电压模式 PWM 控制器 STD BUCK PWM/1 5%/14 RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel |
| HIP6013CBZ-T | 功能描述:电压模式 PWM 控制器 STD BUCK PWM/1 5%/14 RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel |
| HIP6014 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Buck and Synchronous-Rectifier (PWM) Controller and Output Voltage Monitor |
| HIP6014CB | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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