- 您现在的位置：买卖IC网 > PDF目录371821 > HIP6019BCB (HARRIS SEMICONDUCTOR) Advanced Dual PWM and Dual Linear Power Control PDF资料下载
参数资料
| 型号： | HIP6019BCB |
| 厂商： | HARRIS SEMICONDUCTOR |
| 元件分类： | 稳压器 |
| 英文描述： | Advanced Dual PWM and Dual Linear Power Control |
| 中文描述： | DUAL SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PDSO28 |
| 封装： | SOIC-28 |
| 文件页数： | 10/15页 |
| 文件大小： | 362K |
| 代理商： | HIP6019BCB |
276
Layout Considerations
MOSFETs switch very fast and efficiently. The speed with
which the current transitions from one device to another
causes voltage spikes across the interconnecting
impedances and parasitic circuit elements. The voltage
spikes can degrade efficiency, radiate noise into the circuit,
and lead to device over-voltage stress. Careful component
layout and printed circuit design minimizes the voltage
spikes in the converter. Consider, as an example, the turnoff
transition of the upper MOSFET. Prior to turnoff, the upper
MOSFET was carrying the full load current. During the
turnoff, current stops flowing in the upper MOSFET and is
picked up by the lower MOSFET or Schottky diode. Any
inductance in the switched current path generates a large
voltage spike during the switching interval. Careful
component selection, tight layout of the critical components,
and short, wide circuit traces minimize the magnitude of
voltage spikes. Contact Intersil for evaluation board
drawings of the component placement and printed circuit
board.
There are two sets of critical components in a DC-DC converter
using a HIP6019B controller. The power components are the
most critical because they switch large amounts of energy. The
critical small signal components connect to sensitive nodes or
supply critical bypassing current.
The power components should be placed first. Locate the
input capacitors close to the power switches. Minimize the
length of the connections between the input capacitors and
the power switches. Locate the output inductor and output
capacitors between the MOSFETs and the load. Locate the
PWM controller close to the MOSFETs.
+5V
IN
The critical small signal components include the bypass
capacitor for VCC and the soft-start capacitor, C
SS
. Locate
these components close to their connecting pins on the
control IC. Minimize any leakage current paths from SS
node because the internal current source is only 11
μ
A.
A multi-layer printed circuit board is recommended. Figure 10
shows the connections of the critical components in the
converter. Note that capacitors C
IN
and C
OUT
could each
represent numerous physical capacitors. Dedicate one solid
layer for a ground plane and make all critical component
ground connections with vias to this layer. Dedicate another
solid layer as a power plane and break this plane into smaller
islands of common voltage levels. The power plane should
support the input power and output power nodes. Use copper
filled polygons on the top and bottom circuit layers for the
phase nodes. Use the remaining printed circuit layers for
small signal wiring. The wiring traces from the control IC to the
MOSFET gate and source should be sized to carry 1A
currents. The traces for OUT4 need only be sized for 0.2A.
Locate C
OUT4
close to the HIP6019B IC.
PWM Controller Feedback Compensation
Both PWM controllers use voltage-mode control for output
regulation. This section highlights the design consideration
for a voltage-mode controller. Apply the methods and
considerations to both PWM controllers.
Figure 11 highlights the voltage-mode control loop for a
synchronous-rectified buck converter. The output voltage is
regulated to the reference voltage level. The reference
voltage level is the DAC output voltage for PWM1 and is
1.265V for PWM2. The error amplifier output (V
E/A
) is
1
1
1
1
1
INHIBIT
1
1
1
1
0
2.1
1
1
1
0
1
2.2
1
1
1
0
0
2.3
1
1
0
1
1
2.4
1
1
0
1
0
2.5
1
1
0
0
1
2.6
1
1
0
0
0
2.7
1
0
1
1
1
2.8
1
0
1
1
0
2.9
1
0
1
0
1
3.0
1
0
1
0
0
3.1
1
0
0
1
1
3.2
1
0
0
1
0
3.3
1
0
0
0
1
3.4
1
0
0
0
0
3.5
NOTE: 0 = connected to GND or V
SS
, 1 = open or connected to 5V
through pull-up resistors.
TABLE 1.
PIN NAME
NOMINAL
OUT1
VOLTAGE
DACOUT
VID4
VID3
VID2
VID1
VID0
FIGURE 10. PRINTED CIRCUIT BOARD POWER PLANES AND
ISLANDS
V
OUT1
Q1
Q2
Q3
Q4
C
SS
+12V
C
OCSET2
C
VCC
VCC
OCSET2
L
VIA CONNECTION TO GROUND PLANE
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT PLANE LAYER
L
OUT1
C
OUT1
CR1
HIP6019B
L
L
C
IN
C
OUT2
V
OUT2
V
OUT3
SS
PGND
LGATE1
UGATE1
PHASE1
GATE3
PHASE2
KEY
L
OUT2
GND
UGATE2
OCSET1
R
OCSET1
R
OCSET2
C
OCSET1
HIP6019B
相关PDF资料 |
PDF描述 |
|---|---|
| HIP6019B | FPGA - 100000 SYSTEM GATE 2.5 VOLT - NOT RECOMMENDED for NEW DESIGN |
| HIP6028EVAL1 | Advanced PWM and Dual Linear Power Control with Integrated ACPI Support Interface |
| HIP6028 | Advanced PWM and Dual Linear Power Control with Integrated ACPI Support Interface |
| HIP6028CB | Advanced PWM and Dual Linear Power Control with Integrated ACPI Support Interface |
| HIP6303CB-T | Microprocessor CORE Voltage Regulator Multi-Phase Buck PWM Controller |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HIP6019BCB-T | 功能描述:IC REG QD BCK/LINEAR 28-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 + 切换式 系列:- 标准包装:2,500 系列:- 拓扑:降压（降压）同步（3），线性（LDO）（2） 功能:任何功能 输出数:5 频率 - 开关:300kHz 电压/电流 - 输出 1:控制器 电压/电流 - 输出 2:控制器 电压/电流 - 输出 3:控制器 带 LED 驱动器:无 带监控器:无 带序列发生器:是 电源电压:5.6 V ~ 24 V 工作温度:-40°C ~ 85°C 安装类型:* 封装/外壳:* 供应商设备封装:* 包装:* |
| HIP6019BCBZ | 功能描述:电压模式 PWM 控制器 ADV DL 3PWM & DL LINER PWR CONTROL RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel |
| HIP6019BCBZ-T | 功能描述:电压模式 PWM 控制器 ADV DL 3PWM & DL LINER PWR CONTROL RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel |
| HIP6019BEVAL1 | 功能描述:电源管理IC开发工具 HIP6019B EVAL BRD FOR MB PWR MGMT RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| HIP6019CB | 制造商:Harris Corporation 功能描述: |
发布紧急采购，3分钟左右您将得到回复。