参数资料
型号: HIP6521CB
厂商: Intersil
文件页数: 13/13页
文件大小: 356K
描述: IC REG QD BCK/LINEAR SYNC 16SOIC
标准包装: 48
拓扑: 降压(降压)同步(1),线性(LDO)(3)
功能: 任何功能
输出数: 4
频率 - 开关: 300kHz
电压/电流 - 输出 1: 控制器
电压/电流 - 输出 2: 控制器
电压/电流 - 输出 3: 控制器
带 LED 驱动器:
带监控器:
带序列发生器:
电源电压: 4.75 V ~ 5.25 V
工作温度: 0°C ~ 70°C
安装类型: *
封装/外壳: 16-SOIC(0.154",3.90mm 宽)
供应商设备封装: *
包装: 管件
13
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Intersil Corporations quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN4837.5
October 16, 2006
HIP6521
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the MO Series Symbol List in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension D does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension E does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. L is the length of terminal for soldering to a substrate.
7. N is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width B, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA
E
D
N
1   2   3
-B-
0.25(0.010)
C  A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45?/DIV>
C
H
0.25(0.010)
B
M
M
?/DIV>
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3859
0.3937
9.80
10.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
16
16
7
?/DIV>
0?/DIV>
8?/DIV>
0?/DIV>
8?/DIV>
-
Rev. 1 6/05
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HIP6521CBZA 功能描述:IC REG QD BCK/LINEAR 16-SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 + 切换式 系列:- 标准包装:2,500 系列:- 拓扑:降压(降压)同步(3),线性(LDO)(2) 功能:任何功能 输出数:5 频率 - 开关:300kHz 电压/电流 - 输出 1:控制器 电压/电流 - 输出 2:控制器 电压/电流 - 输出 3:控制器 带 LED 驱动器:无 带监控器:无 带序列发生器:是 电源电压:5.6 V ~ 24 V 工作温度:-40°C ~ 85°C 安装类型:* 封装/外壳:* 供应商设备封装:* 包装:*
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