参数资料
型号: HIP6603BCB-T
厂商: Intersil
文件页数: 2/12页
文件大小: 0K
描述: IC DRIVER MOSFET SYNC BUCK 8SOIC
标准包装: 2,500
配置: 高端和低端,同步
输入类型: PWM
电流 - 峰: 400mA
配置数: 1
输出数: 2
高端电压 - 最大(自引导启动): 15V
电源电压: 10.8 V ~ 13.2 V
工作温度: 0°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 带卷 (TR)
HIP6601B, HIP6603B, HIP6604B
Ordering Information
TEMP.
Pinouts
HIP6601BCB, HIP6603BCB,
HIP6601BECB, HIP6603BECB,
PART NUMBER
(Notes 1, 2)
PART
MARKING
RANGE
(°C)
PACKAGE
(Pb-free)
PKG.
DWG. #
(8 LD SOIC, EPSOIC)
TOP VIEW
HIP6601BCBZ*
6601 BCBZ
0 to +85
8 Ld SOIC
M8.15
UGATE
1
8
PHASE
HIP6601BCBZA*
6601 BCBZ
0 to +85
8 Ld SOIC
M8.15
HIP6601BECBZ*
6601 BECBZ
0 to +85
8 Ld EPSOIC M8.15B
BOOT
2
7
PVCC
HIP6601BECBZA* 6601 BECBZ
0 to +85
8 Ld EPSOIC M8.15B
PWM
3
6
VCC
HIP6603BCBZ*
6603 BCBZ
0 to +85
8 Ld SOIC
M8.15
GND
4
5
LGATE
HIP6603BECBZ*
6603 BECBZ
0 to +85
8 Ld EPSOIC M8.15B
HIP6604B
HIP6604BCRZ*
66 04BCRZ
0 to +85
16 Ld QFN
L16.4x4
(16 LD QFN)
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on
reel specifications.
NOTES:
TOP VIEW
1. These Intersil Pb-free plastic packaged products employ special Pb-free
material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and
NC 1
16
15
14
13
12 NC
compatible with both SnPb and Pb-free soldering operations). Intersil Pb-
free products are MSL classified at Pb-free peak reflow temperatures that
BOOT 2
11
PVCC
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. For Moisture Sensitivity Level (MSL), please see device information
PWM 3
10 LVCC
page for HIP6601B , HIP6603B , HIP6604B . For more information
GND 4
9
VCC
on MSL, please see Technical Brief TB363 .
5
6
7
8
Block Diagrams
HIP6601B AND HIP6603B
PVCC
VCC
+5V
BOOT
UGATE
? VCC FOR HIP6601B
10k
SHOOT-
THROUGH
PHASE
PVCC FOR HIP6603B
PWM
10k
CONTROL
LOGIC
PROTECTION
?
LGATE
GND
PVCC
VCC
+5V
PAD
SHOOT-
FOR HIP6601BECB AND HIP6603BECB DEVICES, THE PAD ON THE BOTTOM
SIDE OF THE PACKAGE MUST BE SOLDERED TO THE PC BOARD.
HIP6604B QFN PACKAGE
BOOT
UGATE
PHASE
10k
THROUGH
PWM
CONTROL
PROTECTION
LVCC
CONNECT LVCC TO VCC FOR HIP6601B CONFIGURATION
CONNECT LVCC TO PVCC FOR HIP6603B CONFIGURATION.
GND
10k
LOGIC
2
PAD
LGATE
PGND
PAD ON THE BOTTOM SIDE OF THE PACKAGE MUST BE SOLDERED TO THE PC BOARD
FN9072.8
May 1, 2012
相关PDF资料
PDF描述
RKZ-1205S CONV DC/DC 2W SGL 5V OUT SIP7
B250-13 DIODE SCHOTTKY 50V 2A SMB
HIP6603BCB IC DRIVER MOSFET SYNC BUCK 8SOIC
RKZ-0515S CONV DC/DC 2W 05VIN 15VOUT
GBA15DTKN-S288 CONN EDGECARD 30POS .125 EXTEND
相关代理商/技术参数
参数描述
HIP6603BCBZ 功能描述:功率驱动器IC SYNCHCT BUCK MSFT DRVR FLEXIBLE G RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube
HIP6603BCBZ-T 功能描述:功率驱动器IC SYNCHCT BUCK MOS DRVR FLEXIBLE GATE RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube
HIP6603BECB 功能描述:IC DRIVER MOSF SYNC BUCK 8EPSOIC RoHS:否 类别:集成电路 (IC) >> PMIC - MOSFET,电桥驱动器 - 外部开关 系列:- 标准包装:50 系列:- 配置:低端 输入类型:非反相 延迟时间:40ns 电流 - 峰:9A 配置数:1 输出数:1 高端电压 - 最大(自引导启动):- 电源电压:4.5 V ~ 35 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:TO-263-6,D²Pak(5 引线+接片),TO-263BA 供应商设备封装:TO-263 包装:管件
HIP6603BECB-T 功能描述:IC DRIVER MOSF SYNC BUCK 8EPSOIC RoHS:否 类别:集成电路 (IC) >> PMIC - MOSFET,电桥驱动器 - 外部开关 系列:- 标准包装:50 系列:- 配置:低端 输入类型:非反相 延迟时间:40ns 电流 - 峰:9A 配置数:1 输出数:1 高端电压 - 最大(自引导启动):- 电源电压:4.5 V ~ 35 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:TO-263-6,D²Pak(5 引线+接片),TO-263BA 供应商设备封装:TO-263 包装:管件
HIP6603BECBZ 功能描述:功率驱动器IC SYNCHRONUSCTIFIED BUCK MSFT DRVR RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube