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参数资料
| 型号： | HK10051N2S |
| 厂商： | TAIYO YUDEN CO LTD |
| 元件分类： | 通用定值电感 |
| 英文描述： | 1 ELEMENT, 0.0012 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 封装： | CHIP, 0402, ROHS COMPLIANT |
| 文件页数： | 14/21页 |
| 文件大小： | 755K |
| 代理商： | HK10051N2S |
mlci0109_reli-PRP16
mlci0109_reli_e-01
■ PRECAUTIONS
＊This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specication.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
5. Cleaning
Precautions
◆Cleaning conditions
1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of ux used and purpose of
the cleaning（e.g. to remove soldering ux or other materials from the production process.）
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's characteristics.
Technical
consider-
ations
◆Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as ux residue to adhere to the inductor, resulting in a degradation of the inductor's
electrical properties（especially insulation resistance）.
2. Inappropriate cleaning conditions（insufcient or excessive cleaning）may detrimentally affect the performance of the inductors.
（1）Excessive cleaning
a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the inductor
or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked;
Ultrasonic output
Below 20W/
Ultrasonic frequency
Below 40kHz
Ultrasonic washing period
5 min. or less
6. Post cleaning processes
Precautions
◆Application of resin coatings, moldings, etc. to the PCB and components.
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal
storage conditions resulting in the deterioration of the inductor's performance.
2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor
damage or destruction.
3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors.
The use of such resins, molding materials etc. is not recommended.
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
7. Handling
Precautions
◆Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deection or twisting to the
board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆General handling precautions
1. Always wear static control bands to protect against ESD.
2. Keep the inductors away from all magnets and magnetic objects.
3. Use non-magnetic tweezers when handling inductors.
4. Any devices used with the inductors（soldering irons, measuring instruments）should be properly grounded.
5. Keep bare hands and metal products（i.e., metal desk）away from chip electrodes or conductive areas that lead to chip electrodes.
6. Keep inductors away from items that generate magnetic elds such as speakers or coils.
◆Mechanical considerations
1. Be careful not to subject the inductors to excessive mechanical shocks.
（1）If inductors are dropped on the oor or a hard surface they should not be used.
（2）When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and
humidity in the storage area. Humidity should especially be kept as low as possible.
Recommended conditions
Ambient temperature Below 40℃
Humidity
Below 70% RH
The ambient temperature must be kept below 30℃. Even under ideal storage conditions inductor electrode solderability decreases as time passes, so
inductors should be used within 6 months from the time of delivery.
*The packaging material should be kept where no chlorine or sulfur exists in the air.
Technical
consider-
ations
◆Storage
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If
exceeding the above period, please check solderability before using the inductors.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HK10051N2S-T | 功能描述:固定电感器 INDCTR HIFREQ MLTLYR 0402 1.20.3nH RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| HK10051N2S-T | 制造商:TAIYO YUDEN 功能描述:Inductor Series:LG HK 制造商:TAIYO YUDEN 功能描述:INDUCTOR |
| HK-1005-1N2STK | 功能描述:固定电感器 1.2nH 300mA 0.3nH RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| HK10051N5S-T | 功能描述:固定电感器 INDCTR HIFREQ MLTLYR 0402 1.50.3nH RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| HK-1005-1N5STK | 功能描述:固定电感器 1.5nH 300mA 0.3nH RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
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