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参数资料
| 型号： | HMC-MDB207 |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 混频器 |
| 英文描述： | 55000 MHz - 64000 MHz RF/MICROWAVE IMAGE REJECTION MIXER, 11 dB CONVERSION LOSS-MAX |
| 封装： | 2.00 X 1.20 MM, 0.10 MM HEIGHT, DIE-4 |
| 文件页数： | 1/6页 |
| 文件大小： | 189K |
| 代理商： | HMC-MDB207 |
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
GaAs MMIC I/Q MIXER
55 - 64 GHz
v02.0209
General Description
Features
Functional Diagram
Wide IF Bandwidth: DC - 3 GHz
High Image Rejection: 30 dB
High LO to RF Isolation: 30 dB
Passive: No DC Bias Required
Die Size: 2.0 x 1.2 x 0.1 mm
Electrical Specifications,[1] T
A = 25 °C, IF = 2 GHz, LO = +16 dBm
Typical Applications
This HMC-MDB207 is ideal for:
Point-to-Point Radios
Military Radar, ECM & EW
Test & Measurement Equipment
SATCOM
Sensors
The HMC-MDB207 is a monolithic I/Q Mixer which
can be used as either an image reject mixer (IRM)
or a single sideband upconverter.
This passive
MMIC mixer utilizes two double balanced mixer cells
and a 90 degree hybrid. It is fabricated with GaAs
Heterojunction Bipolar Transistor (HBT) Shottky diode
technology.
For downconversion applications, an
external quadrature hybrid can be used to select the
desired sideband while rejecting image signals. All
bond pads and the die backside are Ti/Au metallized
and the Shottky devices are fully passivated for reliable
operation.
The HMC-MDB207 I/Q MMIC Mixer is
compatible with conventional die attach methods,
as well as thermocompression and thermosonic
wire bonding, making it ideal for MCM and hybrid
microcircuit applications.
This compact MMIC is
a much smaller and more consistent alternative to
hybrid style Image Reject Mixers and Single Sideband
Upconverter assemblies. All data shown herein is
measured with the chip in a 50 Ohm environment and
contacted with RF probes.
HMC-MDB207
Parameter
Min.
Typ.
Max.
Units
Frequency Range, RF & LO
55 - 64
GHz
Frequency Range, IF
DC - 3
GHz
Conversion Loss [2]
911
dB
1 dB Compression (Input)
7
dBm
Image Rejection
30
dB
LO to RF Isolation
30
dB
LO to IF Isolation
30
dB
IP3 (Input)
16
dBm
Amplitude Balance
0.7
1.7
dB
Phase Balance
1Deg
[1] Unless otherwise indicated, all measurements are from probed die
[2] Conversion loss assumed that IF1 & IF2 are combined with an ideal off-chip 90° hybrid
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