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参数资料
| 型号： | HMC-MDB207 |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 混频器 |
| 英文描述： | 55000 MHz - 64000 MHz RF/MICROWAVE IMAGE REJECTION MIXER, 11 dB CONVERSION LOSS-MAX |
| 封装： | 2.00 X 1.20 MM, 0.10 MM HEIGHT, DIE-4 |
| 文件页数： | 3/6页 |
| 文件大小： | 189K |
| 代理商： | HMC-MDB207 |
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Outline Drawing
HMC-MDB207
v02.0209
GaAs MMIC I/Q MIXER
55 - 64 GHz
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. TYPICAL BOND PAD IS .004” SQUARE.
3. BACKSIDE METALLIZATION: GOLD.
4. BACKSIDE METAL IS GROUND.
5. BOND PAD METALLIZATION: GOLD.
6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
7. OVERALL DIE SIZE ±.002”
Pad Number
Function
Pin Description
Interface Schematic
1, 3
IF1, IF2
This pad is DC coupled.
2
LO
This pad is DC coupled and matched to 50 Ohms.
4
RF
This pad is DC coupled and matched to 50 Ohms.
Pad Descriptions
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
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