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参数资料
| 型号： | HMC-MDB277 |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 混频器 |
| 英文描述： | 70000 MHz - 90000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER |
| 封装： | 1.55 X 1.4 MM, 0.1 MM HEIGHT, DIE-3 |
| 文件页数： | 2/4页 |
| 文件大小： | 147K |
| 代理商： | HMC-MDB277 |
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Upconverter Conversion Loss
HMC-MDB277
v01.0209
GaAs MMIC FUNDAMENTAL
MIXER, 70 - 90 GHz
Note 1: Measured Performance Characteristics (T
OP
= 25°C)
RF = 81 - 85 GHz
LO = 71 - 75 GHz
IF = 10 GHz
PLO = +14 dBm
PRF = -20 dBm
-14
-12
-10
-8
-6
-4
-2
0
71
72
73
74
75
CONVERSION
LOSS
(dB)
LO FREQUENCY (GHz)
Outline Drawing
Absolute Maximum Ratings
LO Drive
+20 dBm
Storage Temperature
-65 °C to 150 °C
Operating Temperature
-55 °C to 85 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. TYPICAL BOND PAD IS .004” SQUARE.
3. BACKSIDE METALLIZATION: GOLD.
4. BACKSIDE METAL IS GROUND.
5. BOND PAD METALLIZATION: GOLD.
6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
7. OVERALL DIE SIZE ±.002”
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
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