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参数资料
| 型号： | HMC265CB1 |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 上/下变频器 |
| 英文描述： | RF/MICROWAVE DOWN CONVERTER |
| 封装： | WHITE ALUMINA, BGA-25 |
| 文件页数： | 5/6页 |
| 文件大小： | 191K |
| 代理商： | HMC265CB1 |
4 - 150
12 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Web Site: www.hittite.com
MICROWAVE CORPORATION
FEBRUARY 2001
M
IXERS
4
SMT
HMC265CB1 SUB-HARMONIC SMT MIXER 20 - 31 GHz
The BGA package is back-metallized and can be mounted with either eutectic solder or electrically con-
ductive epoxy. The mounting surface should be clean and flat. Placement of the BGA package can be
done manually or with available automatic placement machines.
Eutectic Attach:
Eutectic solder paste may be applied manually or automatically by screen print/dispense methods to the
PCB. Geometry and process should be such as to supply sufficient solder volume to obtain adequate
solder fillets around the balls of the package after reflow without shorting RF/DC ball signal contacts. The
solder should be reflowed in an infrared reflow oven with the appropriate temperature profile for that solder.
The finished fillet should resemble a cylindrical column with a flared pedestal at the substrate surface when
viewed from the side.
Do not expose the BGA package to temperature greater than 220oC for more than 20 seconds.
Epoxy Attach:
Electrically conductive epoxy may be applied in the same manner as mentioned above. Again geometry
and process parameters should be such as to supply sufficient epoxy around each of the balls of the
package without shorting RF/DC ball signal contact . Cure the epoxy per the recommended manufacture's
schedule.
Handling Precautions:
Follow these precautions to avoid permanent damage.
Cleanliness: Handle the devices in a clean environment.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes ( see page 8 - 2 ).
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and
bias cables to minimize inductive pick-up.
General Handling: Handle the BGA package along the edges with a vacuum collet or with a sharp pair of
bent tweezers. Avoiding damaging the solder balls on the package bottom.
Mounting
HMC265CB1
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相关代理商/技术参数 |
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| HMC265LM3 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 31 GHz |
| HMC265LM3_06 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 31 GHz |
| HMC265LM3_08 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 31 GHz |
| HMC265-SX | 功能描述:IC MIXER SUB-HARMONIC DIE 制造商:analog devices inc. 系列:- 包装:散装 零件状态:在售 RF 类型:通用 频率:20GHz ~ 32GHz 混频器数:1 增益:3dB 噪声系数:13dB 辅助属性:降频变频器 电流 - 电源:50mA 电压 - 电源:3 V ~ 4 V 封装/外壳:模具 供应商器件封装:模具 标准包装:2 |
| HMC266 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 20 - 40 GHz |
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