参数资料
型号: HMC322
厂商: HITTITE MICROWAVE CORP
元件分类: 开关
英文描述: 0 MHz - 10000 MHz RF/MICROWAVE SGL POLE EIGHT THROW SWITCH, 3.4 dB INSERTION LOSS
封装: 1.45 X 1.60 MM, 0.10 MM, DIE-14
文件页数: 4/6页
文件大小: 170K
代理商: HMC322
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Outline Drawing
NOTES:
1. DIMENSIONS IN INCHES [MILLIMETERS].
2. DIE THICKNESS IS 0.004”.
3. TYPICAL BOND PAD IS 0.004” SQUARE.
4. TYPICAL BOND PAD SPACING IS 0.006” CENTER TO CENTER.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METALLIZATION: GOLD.
7. BACKSIDE METAL IS GROUND.
8. NO CONNECTION REQUIRED FOR UNLABELED GROUND BOND PADS.
Die Packaging Information [1]
Standard
Alternate
WP-3 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
HMC322
v01.0907
GaAs MMIC SP8T NON-REFLECTIVE
SWITCH, DC - 10 GHz
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