- 您现在的位置：买卖IC网 > PDF目录12790 > HMK316B7474KL-T (Taiyo Yuden)CAP CER 0.47UF 100V 10% X7R 1206 PDF资料下载
参数资料
| 型号： | HMK316B7474KL-T |
| 厂商： | Taiyo Yuden |
| 文件页数： | 18/20页 |
| 文件大小： | 0K |
| 描述： | CAP CER 0.47UF 100V 10% X7R 1206 |
| 产品变化通告： | X5R, X7R Part Number Change |
| 产品目录绘图： | xMK Series_1206_1.6 |
| 标准包装： | 1 |
| 系列： | M |
| 电容： | 0.47µF |
| 电压 - 额定： | 100V |
| 容差： | ±10% |
| 温度系数： | X7R |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | 通用 |
| 封装/外壳： | 1206（3216 公制） |
| 尺寸/尺寸： | 0.126" L x 0.063" W（3.20mm x 1.60mm） |
| 厚度（最大）： | 0.071"（1.80mm） |
| 特点： | 高电压 |
| 包装： | 标准包装 |
| 产品目录页面： | 2172 (CN2011-ZH PDF) |
| 其它名称： | 587-1450-6 |
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid
this, the following points shall be considerable.
（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be
used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle
placement:
Item
Single-sided mounting
Improper method
chipping
or cracking
Proper method
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
supporting pins
or back-up pins
Technical
considerations
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical
impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of
the pin shall be conducted periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect
components. Therefore, the following precautions shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
［Recommended condition］
Amount adhesive
After capacitor are bonded
Figure
212/316 case sizes as examples
a a
a 0.3mm min
b 100 to 120μm
c Adhesives shall not contact land
b
c
c
4. Soldering
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall
not be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
Precautions
Technical
considerations
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to
corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted
and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high
humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning
methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E02R01
相关PDF资料 |
PDF描述 |
|---|---|
| C3225Y5V1H475Z/1.15 | CAP CER 4.7UF 50V Y5V 1210 |
| C2012X5R0J685M/1.25 | CAP CER 6.8UF 6.3V 20% X5R 0805 |
| VE-B5W-CY-S | CONVERTER MOD DC/DC 5.5V 50W |
| VE-B5V-CY-S | CONVERTER MOD DC/DC 5.8V 50W |
| C2012X5R0J685K/1.25 | CAP CER 6.8UF 6.3V 10% X5R 0805 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HMK316B7683KL-T | 制造商:TAIYO YUDEN 功能描述:Cut Tape 制造商:Taiyo Yuden 功能描述:Ceramic capacitor 1206 X7R 100V 68nF 制造商:Taiyo Yuden 功能描述:Cap Ceramic 0.068uF 100V X7R 10% SMD 1206 125°C Embossed T/R |
| HMK316BJ104KL-T | 制造商:TAIYO YUDEN 功能描述:Ceramic Multilayer Capacitor 制造商:Taiyo Yuden 功能描述:Ceramic capacitor 1206 X5R 100V 100nF 制造商:Taiyo Yuden 功能描述:Medium-High Voltage Ceramic Capacitor |
| HMK316BJ105KL-T | 制造商:TAIYO YUDEN 功能描述:Cut Tape 制造商:Taiyo Yuden 功能描述:Ceramic capacitor 1206 X5R 100V 1uF |
| HMK316BJ105ML-T | 功能描述:1μF ±20% 100V 陶瓷电容器 X5R 1206（3216 公制） 制造商:taiyo yuden 系列:M 包装:剪切带（CT） 零件状态:在售 电容:1μF 容差:±20% 电压 - 额定:100V 温度系数:X5R 工作温度:-55°C ~ 85°C 特性:- 等级:- 应用:SMPS 过滤器 故障率:- 安装类型:表面贴装，MLCC 封装/外壳:1206（3216 公制） 大小/尺寸:0.126" 长 x 0.063" 宽（3.20mm x 1.60mm） 高度 - 安装（最大值）:- 厚度（最大值）:0.071"（1.80mm） 引线间距:- 引线形式:- 标准包装:1 |
| HMK316BJ154KL-T | 制造商:TAIYO YUDEN 功能描述:Cut Tape 制造商:Taiyo Yuden 功能描述:Ceramic capacitor 1206 X5R 100V 150nF 制造商:Taiyo Yuden 功能描述:Cap Ceramic 0.15uF 100V X5R 10% SMD 1206 85°C Embossed T/R |
发布紧急采购，3分钟左右您将得到回复。