参数资料
型号: HMMC-2007
元件分类: 开关
英文描述: 0 MHz - 8000 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 1.4 dB INSERTION LOSS
封装: CHIP
文件页数: 6/6页
文件大小: 78K
代理商: HMMC-2007
7-31
This data sheet contains a variety of typical and guaranteed performance data. The
information supplied should not be interpreted as a complete list of circuit specifica-
tions. In this data sheet the term typical refers to the 50th percentile performance. For
additional information contact your local HP sales representative.
Note:
All compression data measured in an individual device mounted in an HP83040
Series Modular Microcircuit Package @ Tcase = 25°C.
Figure 6. HMMC-2007 Bonding Pad Locations. (Dimensions in micrometers)
97
480
863
0
97
0
563
960
660
97
863
相关PDF资料
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HMMC-5022 2000 MHz - 22000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
HMMC-5021 2000 MHz - 22000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
HMMC-5027 2000 MHz - 26500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
HMMC-5034 37000 MHz - 43000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
HMMC-5034 37000 MHz - 43000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
相关代理商/技术参数
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HMMC-2027 制造商:Agilent Technologies 功能描述:RF SWIT SPDT 0MHZ TO 26.5GHZ 27DB CHIP - Gel-pak, waffle pack, wafer, diced wafer on film
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HMMC-3004 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/4 16000MHZ CHIP - Gel-pak, waffle pack, wafer, diced wafer on film
HMMC-3008 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/8 16000MHZ CHIP - Gel-pak, waffle pack, wafer, diced wafer on film
HMMC-3022 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/2 12000MHZ - Gel-pak, waffle pack, wafer, diced wafer on film