参数资料
型号: HMMC-5200
厂商: AGILENT TECHNOLOGIES INC
元件分类: 放大器
英文描述: 0 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
封装: 0.0181 X 0.0161 INCH, 0.0056 INCH HEIGHT, DIE
文件页数: 1/8页
文件大小: 327K
代理商: HMMC-5200
Features
High bandwidth, F
–1 dB:
21 GHz typical
Moderate gain:
9.5 dB ±1 dB @ 1.5 GHz
P
–1 dB @ 1.5 GHz:
12.5 dBm typical
Low l/f noise corner:
< 20 kHz typical
Single supply operation:
> 4.75 volts @ 44 mA typical
Low power dissipation:
190 mW typical for chip
Agilent HMMC-5200
DC–20 GHz HBT Series Shunt Amplifier
1GC1-8000
Data Sheet
Chip size:
410 x 460 m (16.1 x 18.1 mils)
Chip size tolerance: ±10 m (±0.4 mils)
Chip thickness:
127 ± 15 m (5.0 ± 0.6 mils)
Pad dimensions:
70 x 70 m (2.8 x 2.8 mils) or larger
Description
The HMMC-5200 is a DC to 20 GHz,
9.5 dB gain, feedback amplifier
designed to be used as a cascadable
gain block for a variety of applications.
The device consists of a modified
Darlington feedback pair which
reduces the sensitivity to process
variations and provides 50 ohm input/
output port matches. Furthermore, this
amplifier is fabricated using WPTC's
Heterojunction Bipolar Transistor (HBT)
process which provides excellent
process uniformity, reliability and 1/f
noise performance. The device requires
a single positive supply voltage and
generally operates Class-A for good
distortion performance.
Absolute maximum ratings1
Symbol
Parameters/conditions
Minimum
Maximum
Units
V
CC
VDC pad voltage
8.0
Volts
V
PAD
Output pad voltage
3.5
Volts
P
in
RF input power, continuous
+6
dBm
T
J
Junction temperature
+150
°C
T
op
Operating temperature
–55
+85
°C
T
st
Storage temperature
–65
+165
°C
T
max
Maximum assembly temperature
+300
°C
1
Operation in excess of any one of these ratings may result in permanent damage to this device. For normal
operation, all combined bias and thermal conditions should be chosen such that the maximum junction
temperature (T
J) is not exceeded. TA = 25°C except for Top, Tst, and Tmax.
相关PDF资料
PDF描述
HMMC-5618 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
HMMC-5620 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
HMMC-5620 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
HMP3F 2300 MHz - 2700 MHz RF/MICROWAVE 90 DEGREE HYBRID COUPLER, 0.15 dB INSERTION LOSS-MAX
HNC1-2.5P-12DSL 12 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
相关代理商/技术参数
参数描述
HMMC-5220 制造商:未知厂家 制造商全称:未知厂家 功能描述:DC-15 GHz HBT Series-Shunt Amplifier
HMMC-5617 制造商:Agilent Technologies 功能描述:DC-18 GHZ GAAS MMIC AMPLIFIER - Gel-pak, waffle pack, wafer, diced wafer on film
HMMC-5618 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL PWR AMP 20GHZ 5.5V - Gel-pak, waffle pack, wafer, diced wafer on film
HMMC-5620 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL GAIN AMP 20GHZ 7.5V - Gel-pak, waffle pack, wafer, diced wafer on film
HMMD47 制造商:SPRAGUE 功能描述:CAPACITOR SPRAGUE