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参数资料
| 型号： | HMMC-5220 |
| 厂商： | AGILENT TECHNOLOGIES INC |
| 元件分类： | 放大器 |
| 英文描述： | 0 MHz - 15000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | 0.0161 X 0.0181 INCH, DIE |
| 文件页数： | 3/6页 |
| 文件大小： | 136K |
| 代理商： | HMMC-5220 |
3
Figure 1.
Simplified Schematic Diagram
Out
In
Vcc
GND
Applications
The HMMC-5220 can be used for
a variety of applications requir-
ing moderate amounts of gain
and low power dissipation in a
50 ohm system.
Biasing and Operation
The HMMC-5220 can be operat-
ed from a single positive supply.
This supply must be connected
to two points on the chip, name-
ly the Vcc pad and the output
pad. The supply voltage may be
directly connected to the VCC
pad as long as the voltage is be-
tween +4.75 to +7 volts; howev-
er, if the supply is higher than
+7 volts, a series resistor (RCC)
should be used to reduce the
voltage to the VCC pad. See the
bonding diagram for the equa-
tion used to select RCC. In the
case of the output pad, the sup-
ply voltage must be connected
to the output transmission line
through a resistor and an induc-
tor. The required value of the re-
sistor is given by the equation:
Rout = 35.7Vsupply 114.3,
where Vsupply is in volts. If Rout
is greater than 300 ohms, the in-
ductor may be omitted, howev-
er, the amplifier's gain may be
reduced by ~0.5 dB. Figure 4
shows a recommended bonding
strategy.
The chip contains a backside via
to provide a low inductance
ground path; therefore, the
ground pads on the IC should
not be bonded.
The voltage at the IN and OUT
pads of the IC will be approxi-
mately 3.2 Volts; therefore, DC
blocking caps should be used at
these ports.
Assembly Techniques
It is recommended that the RF
input and RF output connec-
tions be made using 0.7 mil di-
ameter gold wire. The chip is
designed to operate with 0.1-0.3
nH of inductance at the RF in-
put and output. This can be ac-
complished by using 10 mil
bond wire lengths on the RF in-
put and output. The bias supply
wire can be a 0.7 mil diameter
gold wire attached to the VCC
bonding pad.
GaAs MMICs are ESD sensitive.
ESD preventive measures must
be employed in all aspects of
storage, handling, and assem-
bly.
MMIC ESD precautions, han-
dling considerations, die attach
and bonding methods are criti-
cal factors in successful GaAs
MMIC performance and reliabil-
ity.
Agilent application note #54,
"GaAs MMIC ESD, Die Attach
and Bonding Guidelines" pro-
vides basic information on these
subjects.
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