参数资料
型号: HSHM-S176DPWR4-8AP1-TR40B
厂商: 3M
文件页数: 2/4页
文件大小: 0K
描述: CONN SOCKET HSHM 176POS 8ROW STR
产品变化通告: TR40B Plating Discontinuation 30/Jul/2010
标准包装: 10
系列: MetPak™ HSHM
连接器类型: 插座,母形插口
连接器类型: D 22
位置数: 176
加载位置的数目: 全部
间距: 0.079"(2.00mm)
行数: 8
安装类型: 通孔,直角
端子: 压配式
触点表面涂层:
触点涂层厚度: 5µin(0.13µm)
包装: 散装
工作温度: -55°C ~ 125°C
其它名称: 00051111566930
05111156693
15020101026
HSHM-S176DPWR1-8AP1-TR40B
3M ? MetPak ? HSHM Press-Fit Power Socket
2 mm Type D, 176 Signal/4 Power Contacts, 8 Rows, Right Angle
50.00
1.969
HSHM Series
2.00
.079
48.00
1.890
P2 P1
I
H
G
22.40
.882
17.40
.685
F
E
D
C
B
A
16.95
.667
2.00
.079
15
25 24 23 22 21 20 19 18 17 16 P4 P3
2.00
.079
46.00
1.811
11 10 9 8
7 6
Z
5 4 3 2
1
2.00
.079
8.80
.346
10.70
.421
0.75
.030
3.30
.130
2.80
.110
mm
(Inch)
Tolerance Unless Noted
mm
0
±3
0.0 0.00
±0.3 ±0.13
[ ] Dimensions for
Reference Only
Ordering Information
HSHM-S176DPWRX - 8AP1 - XXXXX
Plating μm [ μ” ]:
High Speed Option:
1 =Row differential applications
4 =Coaxial and column differential applications
Standard configuration (power blade mate length)
P1 and P2 = 5.0 mm
P3 and P4 = 6.50 mm
For non-standard configurations contact sales representative
TG30 = 0.76 [30] Min. Au Contact Area
2.54 [100] Min. SnPb Terminal Area (RIA C2 & E2 apply)
1.27 [50] Min. Ni All over
Standard Option
TG30L = 0.76 [30] Min. Au Contact Area, Lubricated
2.54 [100] Min. SnPb Terminal Area (RIA C2 & E2 apply)
1.27 [50] Min. Ni All over
Typically higher make order quantities as compared to TG30.
TG50 = 1.27 [50] Min. Au Contact Area, Lubricated
2.54 [100] Min. SnPb Terminal Area (RIA C2 & E2 apply)
1.27 [50] Min. Ni All over
Non-Standard Option (Available with longer lead times and higher
make order quantities, MOQ)
TS-2001-B
Sheet 2 of 3
3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
相关PDF资料
PDF描述
HSHM-S200DE4-8AP1-TG30 CONN SOCKET HSHM 200POS 8ROW R/A
HW-32-09-L-D-400-SM CONN BOARD STACK 64POS SMD
ICL7106CPL+3 IC ADC 3.5DIGIT W/LCD 40-DIP
ICL7107RCPL IC ADC 3.5 DIGIT LCD/LED 40-DIP
ICL7116CPL+3 IC ADC 3.5 DIGIT W/LCD 40-DIP
相关代理商/技术参数
参数描述
HSHM-S200DE1-8AP1-TG30 功能描述:硬公制连接器 HRD METRIC BACKPLANE CONN - STD RoHS:否 制造商:TE Connectivity / AMP 系列:Z-Pack 产品类型:Receptacles 排数:5 位置/触点数量:110 安装角:Right 端接类型:Pin 外壳材料:Polyester 触点材料:Phosphor Bronze 触点电镀:Gold 类型:
HSHM-S200DE1-8AP1-TG30L 功能描述:硬公制连接器 HARD METRIC BCKPLANE CONN - STD RoHS:否 制造商:TE Connectivity / AMP 系列:Z-Pack 产品类型:Receptacles 排数:5 位置/触点数量:110 安装角:Right 端接类型:Pin 外壳材料:Polyester 触点材料:Phosphor Bronze 触点电镀:Gold 类型:
HSHM-S200DE4-8AP1-TG30 功能描述:硬公制连接器 METPAK HSHM SKT T DE 200CT 8RW RT P/F R/D RoHS:否 制造商:TE Connectivity / AMP 系列:Z-Pack 产品类型:Receptacles 排数:5 位置/触点数量:110 安装角:Right 端接类型:Pin 外壳材料:Polyester 触点材料:Phosphor Bronze 触点电镀:Gold 类型:
HSHM-S200E1-8AP1-TG30 功能描述:硬公制连接器 BLACK CONNCTR SOCKET 8-RW HM RoHS:否 制造商:TE Connectivity / AMP 系列:Z-Pack 产品类型:Receptacles 排数:5 位置/触点数量:110 安装角:Right 端接类型:Pin 外壳材料:Polyester 触点材料:Phosphor Bronze 触点电镀:Gold 类型:
HSHM-S200E1-8AP1-TG30L 功能描述:硬公制连接器 HRD METRIC BACKPLANE CONN - STD RoHS:否 制造商:TE Connectivity / AMP 系列:Z-Pack 产品类型:Receptacles 排数:5 位置/触点数量:110 安装角:Right 端接类型:Pin 外壳材料:Polyester 触点材料:Phosphor Bronze 触点电镀:Gold 类型: