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参数资料
| 型号： | HSMS-2800-TR2 |
| 厂商： | AGILENT TECHNOLOGIES INC |
| 元件分类： | 参考电压二极管 |
| 英文描述： | SILICON, MIXER DIODE |
| 封装： | SOT-23, 3 PIN |
| 文件页数： | 6/10页 |
| 文件大小： | 138K |
| 代理商： | HSMS-2800-TR2 |
5
Table 1. Typical SPICE Parameters.
Parameter
Units
HSMS-280x
HSMS-281x
HSMS-282x
BV
V75
25
15
CJ0
pF
1.6
1.1
0.7
EG
eV
0.69
IBV
A
1 E-5
1 E-4
IS
A
3 E-8
4.8 E-9
2.2 E-8
N
1.08
RS
30
10
6.0
PB (VJ)
V
0.65
PT (XTI)
2
M
0.5
Applications Information
Introduction —
Product Selection
Agilent’s family of Schottky
products provides unique solu-
tions to many design problems.
The first step in choosing the right
product is to select the diode type.
All of the products in the
HSMS-280x family use the same
diode chip, and the same is true of
the HSMS-281x and HSMS-282x
families. Each family has a
different set of characteristics
which can be compared most
easily by consulting the SPICE
parameters in Table 1.
A review of these data shows that
the HSMS-280x family has the
highest breakdown voltage, but at
the expense of a high value of
series resistance (Rs). In applica-
tions which do not require high
voltage the HSMS-282x family,
with a lower value of series
resistance, will offer higher
current carrying capacity and
better performance. The HSMS-
281x family is a hybrid Schottky
(as is the HSMS-280x), offering
lower 1/f or flicker noise than the
HSMS-282x family.
In general, the HSMS-282x family
should be the designer’s first
choice, with the -280x family
reserved for high voltage applica-
tions and the HSMS-281x family
for low flicker noise applications.
Assembly Instructions
SOT-323 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-323 (SC-70)
package is shown in Figure 6
(dimensions are in inches). This
layout provides ample allowance
for package placement by auto-
mated assembly equipment
without adding parasitics that
could impair the performance.
0.026
0.039
0.079
0.022
Dimensions in inches
Figure 6. Recommended PCB Pad
Layout for Agilent’s SC70 3L/SOT-323
Products.
Assembly Instructions
SOT-363 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-363 (SC-70,
6 lead) package is shown in
Figure 7 (dimensions are in
inches). This layout provides
ample allowance for package
placement by automated assembly
equipment without adding
parasitics that could impair the
performance.
0.026
0.079
0.018
0.039
Dimensions in inches
Figure 7. Recommended PCB Pad
Layout for Agilent’s SC70 6L/SOT-363
Products.
相关PDF资料 |
PDF描述 |
|---|---|
| HSMS-280E-BLKG | SILICON, MIXER DIODE |
| HSMS-2805L31 | SILICON, MIXER DIODE |
| HSMS-2803L31 | SILICON, MIXER DIODE |
| HSMS-2862L31 | SILICON, MIXER DIODE |
| HSMS-2807L31 | SILICON, MIXER DIODE |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HSMS-2800-TR2G | 功能描述:肖特基二极管与整流器 70 VBR 2 pF RoHS:否 制造商:Skyworks Solutions, Inc. 产品:Schottky Diodes 峰值反向电压:2 V 正向连续电流:50 mA 最大浪涌电流: 配置:Crossover Quad 恢复时间: 正向电压下降:370 mV 最大反向漏泄电流: 最大功率耗散:75 mW 工作温度范围:- 65 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:SOT-143 封装:Reel |
| HSMS-2802 | 制造商:Avago Technologies 功能描述:DIODE SCHOTTKY RF DUAL SOT-23 |
| HSMS-2802-BLKG | 功能描述:肖特基二极管与整流器 70 VBR 2 pF RoHS:否 制造商:Skyworks Solutions, Inc. 产品:Schottky Diodes 峰值反向电压:2 V 正向连续电流:50 mA 最大浪涌电流: 配置:Crossover Quad 恢复时间: 正向电压下降:370 mV 最大反向漏泄电流: 最大功率耗散:75 mW 工作温度范围:- 65 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:SOT-143 封装:Reel |
| HSMS-2802-TR1 | 制造商:Agilent Technologies 功能描述: |
| HSMS-2802-TR1G | 功能描述:肖特基二极管与整流器 70 VBR 2 pF RoHS:否 制造商:Skyworks Solutions, Inc. 产品:Schottky Diodes 峰值反向电压:2 V 正向连续电流:50 mA 最大浪涌电流: 配置:Crossover Quad 恢复时间: 正向电压下降:370 mV 最大反向漏泄电流: 最大功率耗散:75 mW 工作温度范围:- 65 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:SOT-143 封装:Reel |
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