参数资料
| 型号： | HSP45102SC-40Z |
| 厂商： | Intersil |
| 文件页数： | 9/9页 |
| 文件大小： | 0K |
| 描述： | IC OSC NCO 40MHZ 28-SOIC |
| 标准包装： | 26 |
| 类型： | 数控振荡器（NCO） |
| 频率： | 40MHz |
| 电源电压： | 4.75 V ~ 5.25 V |
| 电流 - 电源： | 99mA |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 28-SOIC（0.295"，7.50mm 宽） |
| 包装： | 管件 |
| 供应商设备封装： | 28-SOIC W |
| 安装类型： | 表面贴装 |
9
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
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from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN2810.9
April 25, 2007
HSP45102
Small Outline Plastic Packages (SOIC)
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H
0.25(0.010)
B
M
M28.3 (JEDEC MS-013-AE ISSUE C)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.6969
0.7125
17.70
18.10
3
E
0.2914
0.2992
7.40
7.60
4
e
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.01
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N28
28
7
α
0o
8o
0o
8o
-
Rev. 0 12/93
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相关代理商/技术参数 |
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| HSP45102SI-33 | 制造商:Rochester Electronics LLC 功能描述:12 BIT NUMERICALLY CONTROLLED OSCILLATOR - Bulk |
| HSP45102SI-3396 | 功能描述:可编程振荡器 12 BIT NCO 28LD SOIC,T&R,33MHZ,IND RoHS:否 制造商:IDT 封装 / 箱体:5 mm x 7 mm x 1.5 mm 频率:15.476 MHz to 866.67, 975 MHz to 1300 MHz 频率稳定性:+/- 50 PPM 电源电压:3.63 V 负载电容:10 pF 端接类型:SMD/SMT 输出格式:LVPECL 最小工作温度:- 40 C 最大工作温度:+ 85 C 尺寸:7 mm W x 5 mm L x 1.5 mm H 封装: |
| HSP45102SI-33Z | 功能描述:可编程振荡器 W/ANNEAL 12 BIT NCO 28 33MHZ IND RoHS:否 制造商:IDT 封装 / 箱体:5 mm x 7 mm x 1.5 mm 频率:15.476 MHz to 866.67, 975 MHz to 1300 MHz 频率稳定性:+/- 50 PPM 电源电压:3.63 V 负载电容:10 pF 端接类型:SMD/SMT 输出格式:LVPECL 最小工作温度:- 40 C 最大工作温度:+ 85 C 尺寸:7 mm W x 5 mm L x 1.5 mm H 封装: |
| HSP45102SI-40 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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