HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HJ200201
Issued Date : 2000.12.21
Revised Date : 2002.01.23
Page No. : 3/3
HTL294J
HSMC Product Specification
TO-252 Dimension
*: Typical
Inches
Millimeters
Min.
0.45
1.65
0.90
0.45
6.40
5.40
Inches
Millimeters
Min.
2.20
-
-
-
5.20
1.40
DIM
Min.
0.0177
0.0650
0.0354
0.0177
0.2520
0.2125
Max.
0.0217
0.0768
0.0591
0.0236
0.2677
0.2283
Max.
0.55
1.95
1.50
0.60
6.80
5.80
DIM
Min.
0.0866
-
-
-
0.2047
0.0551
Max.
0.1102
*0.0906
0.0354
0.0315
0.2165
0.0630
Max.
2.80
*2.30
0.90
0.80
5.50
1.60
A
B
C
D
E
F
G
H
I
J
K
L
Notes:
1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
B
A
C
E
H
I
J
K
3
2
1
D
F
G
L
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-252 Plastic Surface Mount Package
HSMC Package Code: J
Marking:
Date Code
9
2
4
H
L
Control Code
J
T