HW/HC 4A – 6A Series Power Modules; dc-dc Converters
18 – 36 Vdc & 36 – 75 Vdc Input; 1.0Vdc to 5Vdc Output
Data Sheet
July 7, 2003
24
Tyco Electronics Power Systems
Surface Mount Information (cont)
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
For further information please contact your local Tyco
Electronics Power Systems Technical Sales
Representative.
Reflow Soldering Information
The HW005 family of power modules is available for
either Through-Hole (TH) or Surface Mount (SMT)
soldering. These power modules are large mass, low
thermal resistance devices and typically heat up
slower than other SMT components. It is
recommended that the customer review data sheets
in order to customize the solder reflow profile for each
application board assembly.
The following instructions must be observed when
SMT soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
The surface mountable modules in the HW005 family
use our newest SMT technology called “Column Pin”
(CP) connectors. Fig 71 shows the new CP connector
before and after reflow soldering onto the end-board
assembly.
HW005 Board
Insulator
Solder Ball
End assembly PCB
Figure 71. Column Pin Connector Before and After
Reflow Soldering
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn/Pb) solder. The CP connector design is
able to compensate for large amounts of co-planarity
and still ensure a reliable SMT solder joint.
Typically, the eutectic solder melts at 183
oC, wets the
land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on
the connection to ensure a reliable solder joint. There
are several types of SMT reflow technologies
currently used in the industry. These surface mount
power modules can be reliably soldered using natural
forced convection, IR (radiant infrared), or a
combination of convection/IR. For reliable soldering
the solder reflow profile should be established by
accurately measuring the modules CP connector
temperatures.
R
E
FLOW
TEMP
(
°C)
0
50
100
150
200
250
300
Preheat zone
max 4oCs-1
Soak zone
30-240s
Heat zone
max 4oCs-1
Peak Temp 235oC
Cooling
zone
1-4oCs-1
T
lim above
205oC
REFLOW TIME (S)
Figure 72. Recommended Reflow Profile
MAX
TEMP
S
O
LD
ER
(
°C)
200
205
210
215
220
225
230
235
240
0
10
203040
5060
TIME LIMIT (S)
Figure 73. Time Limit Curve Above 205
oC Reflow
Lead Free Soldering
The HW005 family of power modules are designed to
be used in a conventional Tin/Lead (Sn/Pd) solder
process where peak reflow temperatures are limited
to less than 235
oC. Users who wish to assemble
these modules in a Lead Free solder process which, it
is expected, will require the use of higher peak reflow
temperatures should contact your local Tyco Power
Systems technical representative for more
information.