参数资料
型号: IBM25EMPPC740EBUF2000
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255
封装: 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
文件页数: 13/43页
文件大小: 431K
代理商: IBM25EMPPC740EBUF2000
Preliminary and subject to change without notice
PPC740 and PPC750 Hardware Specifications
20 of 43
4.0 PPC740 and PPC750 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the PPC740 and PPC750. IBM
offers two ceramic ball grid array (BGA) packages: a 255 CBGA (the PPC740) and a 360
CBGA (the PPC750).
Figure 13 (in part A) shows the pinout of the 255 CBGA package as viewed from the top
surface. Part B shows the side prole of the 255 CBGA package to indicate the direc-
tion of the top surface view.
Figure 13. Pinout of the PPC740 BGA Package as Viewed from the Top Surface
Figure 14 (in part A) shows the pinout of the 360 CBGA package as viewed from the top
surface. Part B shows the side prole of the 360 CBGA package to indicate the direc-
tion of the top surface view.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Not to Scale
Substrate
Assem-
Encapsulation
View
Part B
Die
Part A
相关PDF资料
PDF描述
IBM25EMPPC750EBUB2660 32-BIT, 266 MHz, RISC PROCESSOR, CBGA360
IBM25NPE405H-3BA266CZ 32-BIT, 266 MHz, RISC PROCESSOR, PBGA580
IBM25NPE405H-3DA200CZ 32-BIT, 200 MHz, RISC PROCESSOR, PBGA580
IBM25NPE405L-3DA200CZ 32-BIT, 200 MHz, RISC PROCESSOR, PBGA324
IBM25NPE405L-3FA200CZ 32-BIT, 200 MHz, RISC PROCESSOR, PBGA324
相关代理商/技术参数
参数描述
IBM25EMPPC740LEBA300 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor
IBM25EMPPC740LEBA333 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor
IBM25EMPPC740LEBA366 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor
IBM25EMPPC740LEBA400 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor
IBM25EMPPC740LEBA466 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor