参数资料
型号: IBM25EMPPC740EBUF2000
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255
封装: 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
文件页数: 20/43页
文件大小: 431K
代理商: IBM25EMPPC740EBUF2000
Preliminary and subject to change without notice
PPC740 and PPC750 Hardware Specifications
27 of 43
6.0 PPC740 and PPC750 Microprocessor Package Description
The following sections provide the package parameters and the mechanical dimensions
for the PPC740 and PPC750.
6.1 Parameters for the 255 CBGA Package (PPC740)
The package parameters are as provided in the following list. The package type is 21 x
21 mm, 255-lead ceramic ball grid array (CBGA).
Package outline
21 x 21 mm
Interconnects
255 (16 x 16 ball array - 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.45 mm
Maximum module height
3.00 mm
Ball diameter
0.89 mm (35 mil)
Note: The PPC740 (255 CBGA) package offering is subject to availability - see your IBM
marketing representative.
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