参数资料
型号: IBM25EMPPC740LEBF3000
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255
封装: 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
文件页数: 19/50页
文件大小: 600K
代理商: IBM25EMPPC740LEBF3000
Page 22
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
5/20/99
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
PowerPC 740 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the PowerPC 740, a 255 pin ceramic ball grid array
(BGA) package.
Figure 13 (in part A) shows the pinout of the 255 CBGA package as viewed from the top surface. Part B
shows the side profile of the 255 CBGA package to indicate the direction of the top surface view.
Figure 13. Pinout of the PowerPC 740 BGA Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Not to Scale
Substrate Assembly.
Encapsulation
View
Part B
Die
Part A
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