参数资料
型号: IBM25EMPPC750LFBC3660
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 366 MHz, RISC PROCESSOR, CBGA360
封装: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件页数: 26/50页
文件大小: 600K
代理商: IBM25EMPPC750LFBC3660
Page 28
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
5/20/99
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
PowerPC 750 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the 750. IBM offers a ceramic ball grid array 360
CBGA packages.
Figure 15 (in part A) shows the pinout of the 360 CBGA package as viewed from the top surface. Part B
shows the side profile of the 360 CBGA package to indicate the direction of the top surface view.
Figure 15. Pinout of the 750 360 CBGA Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Not to Scale
Substrate Assembly.
Encapsulation
View
Part B
Die
Part A
17 18 19
U
V
W
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