参数资料
型号: IBM25EMPPC750LFBC3660
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 366 MHz, RISC PROCESSOR, CBGA360
封装: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件页数: 41/50页
文件大小: 600K
代理商: IBM25EMPPC750LFBC3660
Page 42
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
5/20/99
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors.
Dow-Corning Corporation
517-496-4000
Dow-Corning Electronic Materials
P.O. Box 0997
Midland, MI 48686-0997
Figure 22. Thermal Performance of Select Thermal Interface Material
Specic
Ther
mal
Resistance
(Kin
2 /W)
0
0.5
1
1.5
2
0
10
20
30
40
50
60
70
80
Contact Pressure (PSI)
+
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
+
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