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参数资料
| 型号： | IBM25NPE405L-3FA200CZ |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA324 |
| 封装： | 23 X 23 MM, PLASTIC, EBGA-324 |
| 文件页数： | 32/52页 |
| 文件大小： | 907K |
| 代理商： | IBM25NPE405L-3FA200CZ |
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
38
Notes:
1. For a chip mounted on a JEDEC 2S2P card without a heat sink.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
b. TA = TC – P×θCA, where TA is ambient temperature and P is power consumption.
c. TCMax = TJMax – P×θJC, where TJMax is maximum junction temperature and P is power consumption.
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device.
Characteristic
Symbol
Value
Unit
Supply Voltage (Internal Logic)
VDD
0 to +2.7
V
Supply Voltage (I/O Interface)
OVDD
0 to +3.6
V
PLL Supply Voltage 2
AVDD
0 to +2.7
V
Input Voltage (3.3 V LVTTL receivers)
VIN
-0.6 to (OVDD + 0.6)
V
Input Voltage (5.0 V LVTTL receivers)
VIN
-0.6 to (OVDD + 2.4)
V
Storage Temperature Range
TSTG
-55 to +150
°C
Case temperature under bias
TC
-40 to +120
°C
Notes:
1. All voltages are specified with respect to ground (GND).
2. AVDD should be derived from VDD using the following circuit:
Package Thermal Specifications
The NPe405L is designed to operate within a case temperature range of -40°C to 85°C. Thermal resistance values for the
E-PBGA packages in a convection environment are as follows:
Package—Thermal Resistance
Symbol
Airflow
ft/min (m/sec)
Unit
0 (0)
100 (0.51)
200 (1.02)
23mm, 324-balls—Junction-to-Case
θ
JC
222
°C/W
23mm, 324-balls—Case-to-Ambient1
θ
CA
17
15
14
°C/W
VDD
C1
C2
C3
AVDD
L1
L1 – 2.2
H SMT inductor (equivalent to MuRata
LQH3C2R2M34) or SMT chip ferrite bead (equivalent
to MuRata BLM31A700S)
C1 – 3.3
F SMT tantalum
C2 – 0.1
F SMT monolithic ceramic capacitor with X7R
dielectric or equivalent
C3 – 0.01
F SMT monolithic ceramic capacitor with X7R
dielectric or equivalent
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IBM25NPE405L-3FA266C | 制造商:AMCC 制造商全称:Applied Micro Circuits Corporation 功能描述:PowerNP |
| IBM25NPE405L-3FA266CZ | 制造商:AMCC 制造商全称:Applied Micro Circuits Corporation 功能描述:PowerNP |
| IBM25PPC403GAJC33C1 | 制造商:IBM 功能描述: |
| IBM25PPC405CR-3BC200C | 制造商:未知厂家 制造商全称:未知厂家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|316PIN|PLASTIC |
| IBM25PPC405CR-3BC200CZ | 制造商:未知厂家 制造商全称:未知厂家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|316PIN|PLASTIC |
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