参数资料
型号: IBM25PPC740-EB0M3000
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360
封装: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件页数: 16/42页
文件大小: 496K
代理商: IBM25PPC740-EB0M3000
7/15/99
v 3.2
Datasheet
Page 23
Preliminary Copy
PowerPC 750TM SCM RISC Microprocessor
PowerPC 750 Microprocessor Pin Assignments
The following sections contain the pinout diagram for the 750 SCM. IBM offers a 360 pin ceramic ball grid
array package for the 750.
Figure 20 (in part A) shows the pinout of the 360 CBGA package as viewed from the top surface. Part B
shows the side profile of the 360 CBGA package to indicate the direction of the top surface view.
Figure 20. Pinout of the 360 CBGA Package as Viewed from the Top Surface.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
Not to Scale
Substrate Assembly.
Encapsulation
View
Part B
Die
Part A
17
18
19
U
V
W
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