- 您现在的位置：买卖IC网 > PDF目录67683 > IBM25PPC750FX-FB0533T 32-BIT, 700 MHz, RISC PROCESSOR, CBGA292 PDF资料下载
参数资料
| 型号： | IBM25PPC750FX-FB0533T |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 700 MHz, RISC PROCESSOR, CBGA292 |
| 封装： | 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292 |
| 文件页数： | 4/62页 |
| 文件大小： | 452K |
| 代理商： | IBM25PPC750FX-FB0533T |
第1页第2页第3页当前第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页
DD 2.X
PowerPC 750FX RISC Microprocessor
Preliminary
3. Electrical and Thermal Characteristics
Page 10 of 63
Body_750FX_DS_DD2.X.fm.2.0
June 9, 2003
Note: All electrical specifications (AC, DC, timing) are guaranteed only while the device is operated within
the recommended operating conditions (see Table 3-2). Operation at other application conditions may also
be possible; see the PowerPC 750FX RISC Microprocessor Datasheet Supplement for details.
Table 3-2. Recommended Operating Conditions
Characteristic
Symbol
Value
Unit
Notes
Core supply voltage (full-on mode)
VDD
1.4 to 1.5
V
1, 2
Low Voltage (Low Frequency Operation, 1.8V and 2.5V
bus modes only)
VDD
1.2 Minimum
V
1
PLL supply voltage
AVDD
1.4 to 1.5
V
2
60x bus supply voltage (1.8V)
OVDD
1.7 to 1.9
V
2
60x bus supply voltage (2.5V)
OVDD
2.375 to 2.625
V
2
60x bus supply voltage (3.3V)
OVDD
3.135 to 3.465
V
Input voltage
VIN
GND to OVDD
V2
Die-junction temperature DD2.0 and 2.1
TJ
0 to 105
°C
Die-junction temperature DD2.2 and 2.3
TJ
-40 to 105
Notes:
1. In some cases, when using 1.8v or 2.5v IO mode, it is possible to reduce power dissipation by lowering the core power supply volt-
age. See the Datasheet Supplement for details.
2. These are tested operating conditions.
Table 3-3. Package Thermal Characteristics1
Characteristic
Symbol2
Value
Unit
CBGA package thermal resistance, junction-to-case thermal resistance (typical)
θ
JC
0.06
°C/W
CBGA package thermal resistance, junction-to-lead thermal resistance (typical)
θ
JB
7.6
°C/W
Notes:
1. A heat sink is required (see Section 5.8 Thermal Management on page 49).
2.
θ
JC
is the internal resistance from the junction to the back of the die. For more information about thermal management, see
相关PDF资料 |
PDF描述 |
|---|---|
| IBM25PPC750FX-FB0112T | 32-BIT, 600 MHz, RISC PROCESSOR, CBGA292 |
| IBM25PPC750FX-GB0123T | 32-BIT, 600 MHz, RISC PROCESSOR, CBGA292 |
| IBM25PPC750FX-EB0122T | 32-BIT, 600 MHz, RISC PROCESSOR, CBGA292 |
| IBM25PPC750GLECR5HA3T | 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA292 |
| IBM25PPC750GXEAR5H42T | 32-BIT, 933 MHz, RISC PROCESSOR, CBGA292 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IBM25PPC750FX-FB1013T | 制造商:IBM 功能描述:32-BIT, 733 MHZ, RISC PROCESSOR, CBGA292 |
| IBM25PPC750FX-FB2513T | 制造商:IBM 功能描述:32-BIT, 800 MHz, RISC PROCESSOR, CBGA292 |
| IBM25PPC750FX-GB0122V | 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays |
| IBM25PPC750FX-GB0132T | 制造商:IC'S/TRANSISTORS/DIO 功能描述: 制造商:IC'S/TRANSISTORS/DIODES 功能描述: |
| IBM25PPC750FX-GB0132V | 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays |
发布紧急采购，3分钟左右您将得到回复。