- 您现在的位置：买卖IC网 > PDF目录136444 > IBM25PPC750L-FB0A466W 32-BIT, 466 MHz, RISC PROCESSOR, CBGA360 PDF资料下载
参数资料
| 型号： | IBM25PPC750L-FB0A466W |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 466 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 3/46页 |
| 文件大小： | 610K |
| 代理商： | IBM25PPC750L-FB0A466W |
第1页第2页当前第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页
9/30/99
Version 2.0
Datasheet
Page 7
PowerPC 750 SCM RISC Microprocessor
Preliminary Copy
PID8p-750
The following table provides the package thermal characteristics for the PID8p-750.
The PID8p-750 incorporates a thermal management assist unit (TAU) composed of a thermal sensor, digital-
to-analog converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See the 750
RISC Microprocessor User’s Manual for more information on the use of this feature. Specifications for the
thermal sensor portion of the TAU are found in the table below.
L2 bus supply voltage, pin A19 tied to HRESET
L2OV
DD(2.5V)
2.375 to 2.625
V
L2 bus supply voltage, pin A19 tied to GND
L2OV
DD(1.8V)
1.71 to 1.89
V
Input voltage (under AC conditions, inputs must go rail to
rail for maximum AC timing performance)
V
IN(60X)
GND to OV
DD
V
IN(L2)
GND to L2OV
DD
V
Die-junction temperature
T
J
0 to 105
°C
Package Thermal Characteristics
Characteristic
Symbol
Value
Unit
CBGA package thermal resistance, junction-to-case ther-
mal resistance (typical)
θ
JC
0.03
°C/W
CBGA package thermal resistance, junction-to-lead ther-
mal resistance (typical)
θ
JB
3.8
°C/W
Note: Refer to Section “Thermal Management Information,” on page 34 for more information about thermal management.
Thermal Sensor Specications
See Table “Recommended Operating Conditions1,2,3,” on page 6, for operating conditions.
Num
Characteristic
Minimum
Maximum
Unit
Notes
1
Temperature range
0
128
°C1
2
Comparator settling time
20
—
ms
2
3
Resolution
4
—
°C3
Note:
1. The temperature is the junction temperature of the die. The thermal assist unit's (TAU) raw output does not indicate an absolute temperature, but it
must be interpreted by software to derive the absolute junction temperature. For information on how to use and calibrate the TAU, contact your local
IBM sales office. This specification reflects the temperature span supported by the design.
2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into the THRM3 SPR.
3. This value is guaranteed by design and is not tested.
Recommended Operating Conditions1,2,3
Characteristic
Symbol
Value
Unit
Note:
1. These are recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed.
2. For dd3.x, If W1 is left unconnected, the 60X bus will default to OVDD = 3.3V. For dd2x, W1=Don’t care
3. For dd3.x, If A19 is left unconnected, the L2 bus will default to L2OVDD = 3.3V. For dd2x, W1=Don’t care
相关PDF资料 |
PDF描述 |
|---|---|
| IBM25PPC750GXEAR5H43T | 32-BIT, 933 MHz, RISC PROCESSOR, CBGA292 |
| IBM25PPC750GXEBB6572T | 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA292 |
| ISL8705IBZ | DSP-ADDRESS SEQUENCER, PDSO14 |
| ICS932S208DG | 400 MHz, PROC SPECIFIC CLOCK GENERATOR, PDSO56 |
| IDT79R3041-20JG | 32-BIT, 20 MHz, RISC PROCESSOR, PQCC84 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IBM25PPC750L-FB0B300W | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor |
| IBM25PPC750L-FB0B333W | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor |
| IBM25PPC750L-FB0B350W | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor |
| IBM25PPC750L-FB0B366W | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor |
| IBM25PPC750L-FB0B375W | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor |
发布紧急采购，3分钟左右您将得到回复。