参数资料
型号: ICE2000
厂商: Microchip Technology
文件页数: 10/18页
文件大小: 0K
描述: EMULATOR MPLAB-ICE 2000 POD
产品培训模块: Asynchronous Stimulus
标准包装: 1
系列: MPLAB® ICE 2000
类型: 微控制器
适用于相关产品: Microchip 8 位 PICmicro? 微控制器
所含物品: 仿真器转接板、MPLAB IDE 软件、平行缆线、电源与缆线、仿真器支座、逻辑探针与用户指南
产品目录页面: 658 (CN2011-ZH PDF)
相关产品: XLT28SS2-1-ND - SOCKET TRANSITION 28DIP-28SSOP
PCM18XQ2-ND - MODULE PROCESSOR FOR PIC18F8490
PIC16F723T-I/SOTR-ND - IC PIC MCU FLASH 4KX14 28SOIC
PIC16F723-I/SO-ND - IC PIC MCU FLASH 4KX14 28-SOIC
PIC16F723-E/SO-ND - IC PIC MCU FLASH 4KX14 28-SOIC
PIC16F722T-I/SOTR-ND - IC PIC MCU FLASH 2KX14 28SOIC
PIC16F722-I/SO-ND - IC PIC MCU FLASH 2KX14 28-SOIC
PIC16F722-E/SO-ND - IC PIC MCU FLASH 2KX14 28-SOIC
PCM16YR0-ND - MODULE PROC PIC16F88X
PCM16XP1-ND - MODULE PROC PIC16F627,628
更多...
MPLAB ? ICE 2000
6.0
DEVICE ADAPTER TARGET
TABLE 6-1:
DVA DIMENSIONS – DIP
FOOTPRINTS
Package
DVA Number*
A
B
To connect an emulator device adapter directly to a
target board (without the use of transition sockets) the
following information will be helpful.
8P/14P DIP DVA1002
8P/14P/20P DIP DVA1004
8P DIP DVA12XP080
1.700
1.700
2.200
2.100
2.425
1.650
6.1
DIP Device Footprints
8P DIP
DVA12XP081
2.200
1.650
DIP device adapter footprints shown will accept
adapter plugs like Samtec series APA plugs. These
plugs can be soldered in place during develop-
ment/emulation and eliminate the need for any other
sockets.
14P DIP
14P DIP
18P DIP
18P DIP
18P DIP
DVA16XP140
DVA16XP141
DVA16XP180
DVA16XP182
DVA16XP183
2.200
2.000
2.200
2.000
2.150
1.650
2.100
1.650
2.100
2.575
FIGURE 6-1:
DVA DRAWING – DIP
18P DIP
DVA16XP185
2.150
2.000
B
x
A
x = Pin 1 location
See Table 6-1 for A & B dimensions.
0.028 DIA
18P DIP
18P DIP
18P DIP
20P DIP
20P DIP
20P DIP
28P DIP
28P DIP
28P DIP
28P DIP
40P DIP
40P DIP
40P DIP
DVA16XP186
DVA16XP187
DVA18XP180
DVA16XP200
DVA16XP201
DVA16XP202
DVA14XP280
DVA16XP280
DVA16XP282
DVA18XP280
DVA16XP401
DVA17XP401
DVA18XP400
2.000
2.000
2.150
2.150
2.150
2.200
2.200
2.200
2.000
2.000
2.200
2.200
2.200
2.100
2.100
2.575
2.575
1.825
2.675
1.700
1.700
2.100
2.100
2.200
2.000
2.200
0.100
PLATED-THRU
HOLES
64P DIP DVA16XP640 2.500
* See the MPLAB ? ICE 2000 Readme file for
2.050
information on devices supported by each DVA.
C
DIP
8-Pin
14-Pin
18-Pin
20-Pin
C
0.300
0.300
0.300
0.300
DIP
28-Pin
40-Pin
64-Pin
C
0.300
0.600
0.750
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing of DIP is 40-pin.
DS51140M-page 10
? 2006 Microchip Technology Inc.
相关PDF资料
PDF描述
346-056-522-201 CARDEDGE 56POS DUAL .125 GREEN
346-056-521-804 CARDEDGE 56POS DUAL .125 GREEN
EBC06DRTF-S13 CONN EDGECARD 12POS .100 EXTEND
346-056-521-802 CARDEDGE 56POS DUAL .125 GREEN
SBR20A40CT DIODE SBR 20A 40V TO220-3
相关代理商/技术参数
参数描述
ICE2000 制造商:Microchip Technology Inc 功能描述:MICROCONTROLLER DEVELOPMENT TOOL
ICE2000USERGUIDE 制造商:未知厂家 制造商全称:未知厂家 功能描述:ICE 2000 User Guide
ICE-203-SD2-TG 制造商:3M Electronic Products Division 功能描述:
ICE-203-S-TG 功能描述:IC 与器件插座 20P OPN BDY SCRW MCH RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C
ICE-203-S-TG30 功能描述:IC 与器件插座 20P OPN BDY SCRW MCH RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C