参数资料
型号: ICS343MLF
厂商: INTEGRATED DEVICE TECHNOLOGY INC
元件分类: 时钟产生/分配
英文描述: 200 MHz, OTHER CLOCK GENERATOR, PDSO8
封装: 0.150 INCH, LEAD FREE, SOIC-8
文件页数: 2/7页
文件大小: 149K
代理商: ICS343MLF
Field Programmable Triple Output SS VersaClock
MDS 343 F
2
Revision 090704
Integrated Circuit Systems, Inc.
525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com
ICS343
Pin Assignment
8-pin (150 mil) SOIC
Output Clock Selection Table
Pin Descriptions
External Components
Series Termination Resistor
Clock output traces over one inch should use series
termination. To series terminate a 50
trace (a
commonly used trace impedance), place a 33
resistor
in series with the clock line, as close to the clock output
pin as possible. The nominal impedance of the clock
output is 20
.
Decoupling Capacitor
As with any high-performance mixed-signal IC, the
ICS343 must be isolated from system power supply
noise to perform optimally.
A decoupling capacitor of 0.01F must be connected
between VDD and the PCB ground plane.
Crystal Load Capacitors
The device crystal connections should include pads for
small capacitors from X1 to ground and from X2 to
ground. These capacitors are used to adjust the stray
capacitance of the board to match the nominally
required crystal load capacitance. Because load
capacitance can only be increased in this trimming
process, it is important to keep stray capacitance to a
minimum by using very short PCB traces (and no vias)
been the crystal and device. Crystal capacitors must be
connected from each of the pins X1 and X2 to ground.
The value (in pF) of these crystal caps should equal
(CL -6 pF)*2. In this equation, CL= crystal load
capacitance in pF. Example: For a crystal with a 16 pF
load capacitance, each crystal capacitor would be 20
pF [(16-6) x 2] = 20.
PCB Layout Recommendations
For optimum device performance and lowest output
phase noise, the following guidelines should be
observed.
1) The 0.01F decoupling capacitor should be mounted
on the component side of the board as close to the
VDD pin as possible. No vias should be used between
X1 / I CL K
VD D
GND
PD TS
CL K1
CL K 2
CL K 3
X2
1
2
3
4
8
7
6
5
CLK2
CLK3
Output
Frequency
User
Configurable
User
Configurable
User
Configurable
Spread
Amount
User
Configurable
User
Configurable
User
Configurable
Pin
Number
Pin
Name
Pin
Type
Pin Description
1
X1/ICLK
XI
Connect this pin to a crystal or external clock input.
2
VDD
Power
Connect to +3.3 V.
3
GND
Power
Connect to ground.
4
CLK1
Output
Clock output. Weak internal pull-down when tri-state.
5
CLK3
Output
Clock output. Weak internal pull-down when tri-state.
6
CLK2
Output
Clock output. Weak internal pull-down when tri-state.
7PDTS
Input
Powers down entire chip. Tri-states CLK outputs when low. Internal pull-up.
8
X2
XO
Connect this pin to a crystal, or float for clock input.
相关PDF资料
PDF描述
ICS348RI-XX 200 MHz, OTHER CLOCK GENERATOR, PDSO20
ICS348RPT 200 MHz, OTHER CLOCK GENERATOR, PDSO20
ICS348RIPT 200 MHz, OTHER CLOCK GENERATOR, PDSO20
ICS348RI-XXT 200 MHz, OTHER CLOCK GENERATOR, PDSO20
ICS348RIPT 200 MHz, OTHER CLOCK GENERATOR, PDSO20
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