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| 型号： | ICS8305AG-02T |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟及定时 |
| 英文描述： | 8305 SERIES, LOW SKEW CLOCK DRIVER, 4 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO16 |
| 封装： | 4.40 MM X 5.0 MM, 0.92 MM HEIGHT, MO-153, TSSOP-16 |
| 文件页数： | 1/16页 |
| 文件大小： | 1921K |
| 代理商： | ICS8305AG-02T |
LOW SKEW, 1-TO-4 MULTIPLEXED DIFFERENTIAL/
LVCMOS-TO-LVCMOS FANOUT BUFFER
ICS8305-02
IDT / ICS LVCMOS FANOUT BUFFER
1
ICS8305AG-02 REV. A NOVEMBER 13, 2006
PRELIMINARY
GENERAL DESCRIPTION
The ICS8305-02 is a low skew, 1-to-4, Differential/
LVCMOS-to-LVCMOS/LVTTL Fanout Buffer and a
member of the HiPerClockSfamily of High Perfor-
mance Clock Solutions from IDT. The ICS8305-02
has selectable clock inputs that accept either differ-
ential or single ended input levels. The clock enable is internally
synchronized to eliminate runt pulses on the outputs during
asynchronous assertion/deassertion of the clock enable pin.
Outputs are forced LOW when the clock is disabled. A separate
output enable pin controls whether the outputs are in the active
or high impedance state.
Guaranteed output and par t-to-par t skew characteristics
make the ICS8305-02 ideal for those applications demanding
well defined performance and repeatability.
HiPerClockS
ICS
BLOCK DIAGRAM
PIN ASSIGNMENT
OEA
OEB
VDD
CLK_EN
CLK
nCLK
CLK_SEL
LVCMOS_CLK
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
QA0
VDDO_A
QA1
GND
QB0
VDDO_B
QB1
GND
ICS8305-02
16-Lead TSSOP
4.4mm x 5.0mm x 0.92mm package body
G Package
Top View
FEATURES
Four LVCMOS/LVTTL outputs (two banks of two LVCMOS
outputs)
Selectable differential or LVCMOS/LVTTL clock inputs
CLK, nCLK pair can accept the following differential
input levels: LVPECL, LVDS, LVHSTL, HCSL, SSTL
LVCMOS_CLK supports the following input types:
LVCMOS, LVTTL
Maximum output frequency: 250MHz
Output skew: TBD
Part-to-part skew: TBD
Additive phase jitter, RMS: 0.18ps (typical)
Power supply modes:
Core/Output
3.3V/3.3V
3.3V/2.5V
3.3V/1.8V
3.3V/1.5V
0°C to 70°C ambient operating temperature
Available in both standard (RoHS 5) and lead-free (RoHS 6)
packages
LVCMOS_CLK
CLK
nCLK
CLK_SEL
QA0
QA1
QB0
QB1
0
1
CLK_EN
OEB
OEA
D
Q
LE
0
1
Pullup
Pulldown
Pullup/
Pulldown
The Preliminary Information presented herein represents a product in pre-production. The noted characteristics are based on initial product characterization
and/or qualification. Integrated Device Technology, Incorporated (IDT) reserves the right to change any circuitry or specifications without notice.
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PDF描述 |
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| ICS8305AGILFT | 8305 SERIES, LOW SKEW CLOCK DRIVER, 4 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO16 |
| ICS8305AGIT | 8305 SERIES, LOW SKEW CLOCK DRIVER, 4 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO16 |
| ICS8305AG | 8305 SERIES, LOW SKEW CLOCK DRIVER, 4 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO16 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ICS8305AGI | 制造商:ICS 制造商全称:ICS 功能描述:LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER |
| ICS8305AGILF | 功能描述:IC CLOCK BUFFER MUX 2:4 16-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 产品培训模块:High Bandwidth Product Overview 标准包装:1,000 系列:Precision Edge® 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:4 差分 - 输入:输出:是/是 输入:CML，LVDS，LVPECL 输出:CML 频率 - 最大:2.5GHz 电源电压:2.375 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘，16-MLF? 供应商设备封装:16-MLF?（3x3） 包装:带卷 (TR) |
| ICS8305AGILFT | 功能描述:IC CLOCK BUFFER MUX 2:4 16-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS8305AGIT | 制造商:ICS 制造商全称:ICS 功能描述:LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER |
| ICS8305AGLF | 功能描述:IC CLOCK BUFFER MUX 2:4 16-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 产品培训模块:High Bandwidth Product Overview 标准包装:1,000 系列:Precision Edge® 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:4 差分 - 输入:输出:是/是 输入:CML，LVDS，LVPECL 输出:CML 频率 - 最大:2.5GHz 电源电压:2.375 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘，16-MLF? 供应商设备封装:16-MLF?（3x3） 包装:带卷 (TR) |
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