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| 型号： | ICS8316AKLF |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 6/10页 |
| 文件大小： | 0K |
| 描述： | IC CLOCK BUFFER 1:16 32-VFQFPN |
| 标准包装： | 490 |
| 系列： | HiPerClockS™ |
| 类型： | 扇出缓冲器（分配） |
| 电路数： | 1 |
| 比率 - 输入:输出： | 1:16 |
| 差分 - 输入:输出： | 无/无 |
| 输入： | LVCMOS，LVTTL |
| 输出： | LVCMOS，LVTTL |
| 频率 - 最大： | 150MHz |
| 电源电压： | 3.135 V ~ 3.465 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-VFQFN 裸露焊盘 |
| 供应商设备封装： | 32-VFQFPN 裸露焊盘（4x4） |
| 包装： | 托盘 |
| 其它名称： | 8316AKLF |
IDT / ICS 1-TO-16, 1.2V LVCMOS FANOUT BUFFER
5
ICS8316AK REV. B FEBRUARY 29, 2008
ICS8316
LOW SKEW, 1-TO-16, LVCMOS/LVTTL FANOUT BUFFER W/1.2V LVCMOS OUTPUTS
APPLICATION INFORMATION
INPUTS:
LVCMOS CONTROL PINS
All control pins have internal pull-ups or pull-downs; additional
resistance is not required but can be added for additional
protection. A 1k
Ω resistor can be used.
RECOMMENDATIONS FOR UNUSED INPUT AND OUTPUT PINS
OUTPUTS:
LVCMOS OUTPUTS
All unused LVCMOS output can be left floating. We
recommend that there is no trace attached.
FIGURE 1. P.C.ASSEMBLY FOR EXPOSED PAD THERMAL RELEASE PATH –SIDE VIEW (DRAWING NOT TO SCALE)
VFQFN EPAD THERMAL RELEASE PATH
In order to maximize both the removal of heat from the package
and the electrical performance, a land patter n must be
incorporated on the Printed Circuit Board (PCB) within the footprint
of the package corresponding to the exposed metal pad or
exposed heat slug on the package, as shown in
Figure 1. The
solderable area on the PCB, as defined by the solder mask, should
be at least the same size/shape as the exposed pad/slug area on
the package to maximize the thermal/electrical performance.
Sufficient clearance should be designed on the PCB between the
outer edges of the land pattern and the inner edges of pad pattern
for the leads to avoid any shorts.
While the land pattern on the PCB provides a means of heat
transfer and electrical grounding from the package to the board
through a solder joint, thermal vias are necessary to effectively
conduct from the surface of the PCB to the ground plane(s). The
land pattern must be connected to ground through these vias.
The vias act as “heat pipes”. The number of vias (i.e. “heat pipes”)
are application specific and dependent upon the package power
dissipation as well as electrical conductivity requirements. Thus,
thermal and electrical analysis and/or testing are recommended
to determine the minimum number needed. Maximum thermal
and electrical performance is achieved when an array of vias is
incorporated in the land pattern. It is recommended to use as
many vias connected to ground as possible. It is also
recommended that the via diameter should be 12 to 13mils (0.30
to 0.33mm) with 1oz copper via barrel plating. This is desirable to
avoid any solder wicking inside the via during the soldering process
which may result in voids in solder between the exposed pad/
slug and the thermal land. Precautions should be taken to
eliminate any solder voids between the exposed heat slug and
the land pattern. Note: These recommendations are to be used
as a guideline only. For further information, refer to the Application
Note on the Surface Mount Assembly of Amkor’s Thermally/
Electrically Enhance Leadfame Base Package, Amkor Technology.
THERMAL VIA
LAND PATTERN
SOLDER
PIN
SOLDER
PIN PAD
PIN
GROUND PLANE
EXPOSED HEAT SLUG
(GROUND PAD)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ICS8316AKLFT | 功能描述:IC CLOCK BUFFER 1:16 32-VFQFPN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS8316AKT | 制造商:ICS 制造商全称:ICS 功能描述:LOW SKEW, 1-TO-16, LVCMOS / LVTTL FANOUT BUFFER W/1.2V LVCMOS OUTPUTS |
| ICS831721AGILF | 制造商:Integrated Device Technology Inc 功能描述:IC CLK MULTPX 2:1 700MHZ 16TSSOP 制造商:Integrated Device Technology Inc 功能描述:IC MUX DIFF CLOCK/DATA 16TSSOP |
| ICS831721AGILFT | 制造商:Integrated Device Technology Inc 功能描述:IC CLK MULTPX 2:1 700MHZ 16TSSOP 制造商:Integrated Device Technology Inc 功能描述:IC MUX DIFF CLOCK/DATA 16TSSOP |
| ICS831721I | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:Differential Clock/Data Multiplexer |
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