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参数资料
| 型号： | ICS8402AKIT |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 5/19页 |
| 文件大小： | 0K |
| 描述： | IC FREQ SYNTHESIZER 32VFQFPN |
| 标准包装： | 2,500 |
| 系列： | HiPerClockS™ |
| 类型： | 频率合成器 |
| PLL： | 带旁路 |
| 输入： | 晶体 |
| 输出： | LVCMOS，LVTTL |
| 电路数： | 1 |
| 比率 - 输入:输出： | 1:2 |
| 差分 - 输入:输出： | 无/无 |
| 频率 - 最大： | 350MHz |
| 除法器/乘法器： | 是/无 |
| 电源电压： | 3.135 V ~ 3.465 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-VFQFN 裸露焊盘 |
| 供应商设备封装： | 32-VFQFPN（5x5） |
| 包装： | 带卷 (TR) |
| 其它名称： | 8402AKIT |
ICS8402I
350MHZ, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER
IDT / ICS LVCMOS/LVTTL FREQUENCY SYNTHESIZER
13
ICS8402AYI REV. A OCTOBER 16, 2007
Recommendations for Unused Input and Output Pins
Inputs:
Crystal Inputs
For applications not requiring the use of the crystal oscillator input,
both XTAL_IN and XTAL_OUT can be left floating. Though not
required, but for additional protection, a 1k
resistor can be tied
from XTAL_IN to ground.
TEST_CLK Input
For applications not requiring the use of the test clock, it can be left
floating. Though not required, but for additional protection, a 1k
resistor can be tied from the TEST_CLK to ground.
LVCMOS Control Pins
All control pins have internal pull-ups or pull-downs; additional
resistance is not required but can be added for additional
protection. A 1k
resistor can be used.
Outputs:
LVCMOS Outputs
All unused LVDS output pairs can be either left floating or
terminated with 100
across. If they are left floating, we
recommend that there is no trace attached.
VFQFN EPAD Thermal Release Path
In order to maximize both the removal of heat from the package
and the electrical performance, a land pattern must be
incorporated on the Printed Circuit Board (PCB) within the footprint
of the package corresponding to the exposed metal pad or
exposed heat slug on the package, as shown in Figure 5. The
solderable area on the PCB, as defined by the solder mask, should
be at least the same size/shape as the exposed pad/slug area on
the package to maximize the thermal/electrical performance.
Sufficient clearance should be designed on the PCB between the
outer edges of the land pattern and the inner edges of pad pattern
for the leads to avoid any shorts.
While the land pattern on the PCB provides a means of heat
transfer and electrical grounding from the package to the board
through a solder joint, thermal vias are necessary to effectively
conduct from the surface of the PCB to the ground plane(s). The
land pattern must be connected to ground through these vias. The
vias act as “heat pipes”. The number of vias (i.e. “heat pipes”) are
application specific and dependent upon the package power
dissipation as well as electrical conductivity requirements. Thus,
thermal and electrical analysis and/or testing are recommended to
determine the minimum number needed. Maximum thermal and
electrical performance is achieved when an array of vias is
incorporated in the land pattern. It is recommended to use as many
vias connected to ground as possible. It is also recommended that
the via diameter should be 12 to 13mils (0.30 to 0.33mm) with 1oz
copper via barrel plating. This is desirable to avoid any solder
wicking inside the via during the soldering process which may
result in voids in solder between the exposed pad/slug and the
thermal land. Precautions should be taken to eliminate any solder
voids between the exposed heat slug and the land pattern. Note:
These recommendations are to be used as a guideline only. For
further information, please refer to the Application Note on the
Surface Mount Assembly of Amkor’s Thermally/Electrically
Enhance Leadfame Base Package, Amkor Technology.
Figure 5. P.C. Assembly for Exposed Pad Thermal Release Path – Side View (drawing not to scale)
SOLDER
PIN
EXPOSED HEAT SLUG
PIN PAD
GROUND PLANE
LAND PATTERN
(GROUND PAD)
THERMAL VIA
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ICS8402AKLF | 功能描述:IC FREQ SYNTHESIZER 32VFQFPN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™ 标准包装:1,000 系列:- 类型:时钟/频率合成器，扇出分配 PLL:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 除法器/乘法器:- 电源电压:- 工作温度:- 安装类型:表面贴装 封装/外壳:56-VFQFN 裸露焊盘 供应商设备封装:56-VFQFP-EP（8x8） 包装:带卷 (TR) 其它名称:844S012AKI-01LFT |
| ICS8402AKLFT | 功能描述:IC FREQ SYNTHESIZER 32VFQFPN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™ 标准包装:1,000 系列:- 类型:时钟/频率合成器，扇出分配 PLL:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 除法器/乘法器:- 电源电压:- 工作温度:- 安装类型:表面贴装 封装/外壳:56-VFQFN 裸露焊盘 供应商设备封装:56-VFQFP-EP（8x8） 包装:带卷 (TR) 其它名称:844S012AKI-01LFT |
| ICS8402AKT | 制造商:ICS 制造商全称:ICS 功能描述:350MHZ, CRYSTAL-TO-LVCMOS / LVTTL FREQUENCY SYNTHESIZER |
| ICS8402AY | 制造商:ICS 制造商全称:ICS 功能描述:350MHZ, CRYSTAL-TO-LVCMOS / LVTTL FREQUENCY SYNTHESIZER |
| ICS8402AYI | 制造商:ICS 制造商全称:ICS 功能描述:350MHZ, CRYSTAL-TO-LVCMOS / LVTTL FREQUENCY SYNTHESIZER |
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