参数资料
型号: ICS8430AYI-61LF
厂商: IDT, Integrated Device Technology Inc
文件页数: 6/20页
文件大小: 0K
描述: IC SYNTHESIZER LVPECL 32-LQFP
标准包装: 1
系列: HiPerClockS™
类型: 频率合成器
PLL: 带旁路
输入: 晶体
输出: LVPECL
电路数: 1
比率 - 输入:输出: 1:2
差分 - 输入:输出: 无/是
频率 - 最大: 500MHz
除法器/乘法器: 是/无
电源电压: 3.135 V ~ 3.465 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 32-LQFP
供应商设备封装: 32-TQFP(7x7)
包装: 标准包装
其它名称: 800-1924-6
8430AYI-61
www.icst.com/products/hiperclocks.html
REV. C JUNE 2, 2006
14
Integrated
Circuit
Systems, Inc.
ICS8430I-61
500MHZ, CRYSTAL-TO-3.3V, 2.5V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
The following component footprints are used in this layout
example: All the resistors and capacitors are size 0603.
POWER AND GROUNDING
Place the decoupling capacitors C14 and C15 as close as pos-
sible to the power pins. If space allows, placing the decoupling
capacitor at the component side is preferred. This can reduce
unwanted inductance between the decoupling capacitor and the
power pin generated by the via.
Maximize the pad size of the power (ground) at the decoupling
capacitor. Maximize the number of vias between power (ground)
and the pads.This can reduce the inductance between the power
(ground) plane and the component power (ground) pins.
If V
CCA shares the same power supply with VCC, insert the RC
filter R7, C11, and C16 in between. Place this RC filter as close
to the V
CCA pin as possible.
CLOCK TRACES AND TERMINATION
The component placements, locations and orientations should be
arranged to achieve the best clock signal quality. Poor clock signal
quality can degrade the system performance or cause system fail-
ure. In the synchronous high-speed digital system, the clock signal
is less tolerable to poor signal quality than other signals. Any ring-
ing on the rising or falling edge or excessive ring back can cause
system failure. The trace shape and the trace delay might be re-
stricted by the available space on the board and the component
location.While routing the traces, the clock signal traces should be
routed first and should be locked prior to routing other signal traces.
The traces with 50
Ω transmission lines TL1 and TL2 at
FOUT and nFOUT should have equal delay and run ad-
jacent to each other. Avoid sharp angles on the clock trace.
Sharp angle turns cause the characteristic impedance to
change on the transmission lines.
Keep the clock trace on the same layer. Whenever pos-
sible, avoid any vias on the clock traces. Any via on the
trace can affect the trace characteristic impedance and
hence degrade signal quality.
To prevent cross talk, avoid routing other signal traces in
parallel with the clock traces. If running parallel traces is
unavoidable, allow more space between the clock trace
and the other signal trace.
Make sure no other signal trace is routed between the
clock trace pair.
The matching termination resistors R1, R2, R3 and R4 should
be located as close to the receiver input pins as possible. Other
termination schemes can also be used but are not shown in
this example.
CRYSTAL
The crystal X1 should be located as close as possible to the pins
24 (XTAL_OUT) and 25 (XTAL_IN). The trace length between
the X1 and U1 should be kept to a minimum to avoid unwanted
parasitic inductance and capacitance. Other signal traces
should not be routed near the crystal traces.
FIGURE 7B. PCB BOARD LAYOUT FOR ICS8430I-61
R7
X1
R4
TL1, TL21N are 50 Ohm
traces and equal length
C16
C2
PIN 1
C11
C1
TL1
U1
C14
R3
TL1
C15
R2
VIA
Close to the input
pins of the
receiver
R1
TL1N
GND
TL1N
VCCA
VCC
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