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参数资料
| 型号： | ICS844003BG-01LF |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 6/19页 |
| 文件大小： | 0K |
| 描述： | IC SYNTHESIZER 3LVDS 24-ETSSOP |
| 产品培训模块： | PCI-Express |
| 标准包装： | 62 |
| 系列： | HiPerClockS™, FemtoClock™ |
| 类型： | 频率合成器 |
| PLL： | 带旁路 |
| 输入： | LVCMOS，LVTTL，晶体 |
| 输出： | LVDS |
| 电路数： | 1 |
| 比率 - 输入:输出： | 2:3 |
| 差分 - 输入:输出： | 无/是 |
| 频率 - 最大： | 680MHz |
| 除法器/乘法器： | 是/无 |
| 电源电压： | 3.135 V ~ 3.465 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 24-TSSOP |
| 包装： | 管件 |
| 其它名称： | 844003BG-01LF |
ICS844003-01
FEMTOCLOCKSCRYSTAL-TO- LVDS FREQUENCY SYNTHESIZER
IDT / ICS LVDS FREQUENCY SYNTHESIZER
14
ICS844003BG-01 REV. A AUGUST 21, 2008
EPAD Thermal Release Path
In order to maximize both the removal of heat from the package
and the electrical performance, a land pattern must be
incorporated on the Printed Circuit Board (PCB) within the footprint
of the package corresponding to the exposed metal pad or
exposed heat slug on the package, as shown in Figure 5. The
solderable area on the PCB, as defined by the solder mask, should
be at least the same size/shape as the exposed pad/slug area on
the package to maximize the thermal/electrical performance.
Sufficient clearance should be designed on the PCB between the
outer edges of the land pattern and the inner edges of pad pattern
for the leads to avoid any shorts.
While the land pattern on the PCB provides a means of heat
transfer and electrical grounding from the package to the board
through a solder joint, thermal vias are necessary to effectively
conduct from the surface of the PCB to the ground plane(s). The
land pattern must be connected to ground through these vias. The
vias act as “heat pipes”. The number of vias (i.e. “heat pipes”) are
application specific and dependent upon the package power
dissipation as well as electrical conductivity requirements. Thus,
thermal and electrical analysis and/or testing are recommended to
determine the minimum number needed. Maximum thermal and
electrical performance is achieved when an array of vias is
incorporated in the land pattern. It is recommended to use as many
vias connected to ground as possible. It is also recommended that
the via diameter should be 12 to 13mils (0.30 to 0.33mm) with 1oz
copper via barrel plating. This is desirable to avoid any solder
wicking inside the via during the soldering process which may
result in voids in solder between the exposed pad/slug and the
thermal land. Precautions should be taken to eliminate any solder
voids between the exposed heat slug and the land pattern. Note:
These recommendations are to be used as a guideline only. For
further information, refer to the Application Note on the Surface
Mount Assembly of Amkor’s Thermally/Electrically Enhance
Leadfame Base Package, Amkor Technology.
Figure 5. Assembly for Exposed Pad Thermal Release Path - Side View (drawing not to scale)
GROUND PLANE
LAND PATTERN
SOLDER
THERMAL VIA
EXPOSED HEAT SLUG
(GROUND PAD)
PIN
PIN PAD
SOLDER
PIN
PIN PAD
SOLDER
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相关代理商/技术参数 |
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| ICS844003BG-01LFT | 功能描述:IC SYNTHESIZER 3LVDS 24-ETSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™, FemtoClock™ 标准包装:1,000 系列:- 类型:时钟/频率合成器，扇出分配 PLL:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 除法器/乘法器:- 电源电压:- 工作温度:- 安装类型:表面贴装 封装/外壳:56-VFQFN 裸露焊盘 供应商设备封装:56-VFQFP-EP（8x8） 包装:带卷 (TR) 其它名称:844S012AKI-01LFT |
| ICS844003BGI-01LF | 功能描述:IC SYNTHESIZER 3LVDS 24-ETSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™, FemtoClock™ 标准包装:2,000 系列:- 类型:PLL 频率合成器 PLL:是 输入:晶体 输出:时钟 电路数:1 比率 - 输入:输出:1:1 差分 - 输入:输出:无/无 频率 - 最大:1GHz 除法器/乘法器:是/无 电源电压:4.5 V ~ 5.5 V 工作温度:-20°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-LSSOP（0.175"，4.40mm 宽） 供应商设备封装:16-SSOP 包装:带卷 (TR) 其它名称:NJW1504V-TE1-NDNJW1504V-TE1TR |
| ICS844003BGI-01LFT | 功能描述:IC SYNTHESIZER 3LVDS 24-ETSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™, FemtoClock™ 标准包装:1,000 系列:- 类型:时钟/频率合成器，扇出分配 PLL:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 除法器/乘法器:- 电源电压:- 工作温度:- 安装类型:表面贴装 封装/外壳:56-VFQFN 裸露焊盘 供应商设备封装:56-VFQFP-EP（8x8） 包装:带卷 (TR) 其它名称:844S012AKI-01LFT |
| ICS844003EGI-01LF | 功能描述:IC SYNTHESIZER 2LVDS 24-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:FemtoClock™ 标准包装:1,000 系列:Precision Edge® 类型:时钟/频率合成器 PLL:无 输入:CML，PECL 输出:CML 电路数:1 比率 - 输入:输出:2:1 差分 - 输入:输出:是/是 频率 - 最大:10.7GHz 除法器/乘法器:无/无 电源电压:2.375 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘，16-MLF? 供应商设备封装:16-MLF?（3x3） 包装:带卷 (TR) 其它名称:SY58052UMGTRSY58052UMGTR-ND |
| ICS844004AG-01LF | 制造商:Integrated Device Technology Inc 功能描述: |
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