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| 型号： | ICS8534AY-01LF |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟及定时 |
| 英文描述： | 8534 SERIES, LOW SKEW CLOCK DRIVER, 22 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP64 |
| 封装： | 10 X 10 MM, 1 MM HEIGHT, MS-026, TQFP-64 |
| 文件页数： | 6/20页 |
| 文件大小： | 1733K |
| 代理商： | ICS8534AY-01LF |
ICS8534-01
LOW SKEW, 1-TO-22 DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER
IDT / ICS 3.3V LVPECL FANOUT BUFFER
14
ICS8534AY-01 REV. A DECEMBER 6, 2007
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS5334-01.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS534-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 230mA = 796.95mW
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 22 * 30mW = 660mW
Total Power_MAX (3.8V, with all outputs switching) = 796.95mW + 660mW = 153.08mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming 0 air flow
and a multi-layer board, the appropriate value is 17.2°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 1.457W * 17.2°C/W = 110.1°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board (single layer or multi-layer).
Table 6. Thermal Resistance θJA for 64 Lead TQFP, Forced Convection
θ
JA by Velocity
Linear Feet per Minute
0200
500
Multi-Layer PCB, JEDEC Standard Test Boards
22.3°C/W
17.2°C/W
15.1°C/W
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